Planning the multilayer PCB stackup configuration is one of the most important aspects in achieving the best possible performance of a product. A correctly stacked PCB substrate can effectively reduce electromagnetic emissions, crosstalk and also make the product more susceptible to outside noise. These issues can cause intermittent operation due to timing glitches and interference dramatically reducing the products performance and reliability.
This unique method simplifies the rework process allowing the stencil get in to tight spaces, get higher first pass yields as the paste processing window is much wider than with metal stencils.
These rework one-time-use stencils are ideal for connectors, QFPs, and other areas on the PCB requiring rework. They may be designed with or without a solder paste boarder surrounding the area to be reworked.
Are there any industry white papers written that document any advantages in running this alloy? From what I've read, this alloy was formulated to prevent leaching of silver for silver-bearing component terminations... »»
Paste shape and placement ok, reflow 12 zones profile looks ok (same since 2 yrs), component placement ok, one reference in 60 places do tombstone on selected ones (0402 capacitor) - strange thing we found... »»
PLCs (Programmable Logic Controllers) are the brains of your operation. When the PLC is not functioning properly, lines shut down, plants shutdown, even city bridges and water stations could cease to operate.... »»
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