As demands accelerate for increasing density, higher bandwidths, and lower power, many IC design teams are looking up to 3D ICs with through-silicon vias (TSVs). 3D ICs promise "more than Moore" integration by packing a great deal of functionality into small form factors, while improving performance and reducing costs.
3D IC packages may accommodate multiple heterogeneous die-such as logic, memory, analog, RF, and micro-electrical mechanical systems (MEMS)-at different process nodes, such as 28nm for high-speed logic and 130nm for analog. This provides an alternative to system-on-chip (SoC) integration, potentially postponing an expensive move to a new process node for all of the functionality developers want to place in a single package.
Can anyone tell me if there is a formula for finding the after reflow height of solder with no part attached? I have to print some pads that do not have any parts but there can not be more than 1.5mil of solder on the pad after reflow... »»
We want to handle the materials such as PCB & MSD components as per IPC 1601 & J-STD-033. As such, we need a baking oven to perform this and to monitor (temperature � we have to maintain up to 200�C & humidity � below 5%)... »»
World's leading electronics manufacturing events for the design, fabrication, assembly, packaging and testing of printed circuits and electronic assemblies. Part of the global Nepcon series of events... »»
The majority of the industry have been running no clean processes for many years and have often neglected important issues like design for cleaning, selecting compatible components and compatibility between cleaning materials and flux residues... »»
SMTA - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies. Membership Info | SMTA Certification | Bookstore