The tin whisker failures investigated in this paper were found on functional RoHS-compliant hardware. The samples were not conformal coated. This paper will document the conditions associated with the whisker formation under the following conditions; tin plated components, RoHS-compliant assembly, stored in an ESD bag (not sealed), placed inside a box (taped shut) with power from a 3.3 volt battery on components that are in direct contact with the ESD bag. We will address the issue of microenvironments responsible for the formation of tin whiskers.
The BEST PCB Repair Kits are designed to meet the quality of original trace, pad, and plated thru-hole assemblies. These kits give you the tools you need for fast repair and modification of lands, traces, contact fingers, SMT pads, plated hole connections, and PCB base board material.
I have worked with the Mirtec MV2 and 3 for several years. I did perform some evaluation of the red/blue filters. We found it to be usefull for some specialty solder inspections but we found it most usefull for solder inspection of plated test points... »»
We are having difficulty in reflowing BGA wiht ROHS process on double sided board. We have tried profiling un populated board and profile is meeting upper spec of solder paste... »»
World's leading electronics manufacturing events for the design, fabrication, assembly, packaging and testing of printed circuits and electronic assemblies... »»
This is a 1-day course utilizing, lectures, visual acuity exercises, and physical assemblies to provide the students with an experience in visually inspecting printed circuit assemblies... »»
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