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Ground Pours - To Pour Or Not To Pour?

Ground Pours - To Pour Or Not To Pour?

Copper ground pours are created by filling open unused areas with copper generally on the outer layers of the board then connecting the copper fill with stitching vias to ground. Usually, small isolated areas < 2.5.mm square are deleted automatically by the software during the pouring operation.

Some PCB designers do this as a matter of habit stating that they have always done this for various reasons. Also, many reference designs supplied by chip manufacturers use this ground pour technique so you may need to follow their recommendations if you want the design to work especially at high speeds - WRONG!

Read Article...

Author:

Barry Olney

Organization:

In-Circuit Design Pty Ltd

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Forum

When does SMT inspection become rework? - Because we build Class 3 assemblies, our company has formal inspection steps on our routes. CCA's go through surface mount and then an operator inspects the solder joints for defects... »»

Conformal coat 1B73 using SC-205 bubbles - Conformal coat bubbles using 1B73 and SC-205 nozzle I've read most of the posts on this subject. I'm using the SC-205 (airless) fan nozzle and 400 needle to apply 1B73 mixed with xylene thinner... »»

Mirtec programming discussion - Has anyone had any luck programming using the side cameras to inspect for defects on the sides of chip components? We recently had an escape of a damaged chip capacitor that was impossible to see from the top camera... »»

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BGA Rework Training

Seminar/Course | Mon, Feb. 21 | Sponsored by: BEST Inc

A comprehensive course that encompasses the skills necessary to perform rework of electronic printed circuit boards to include PBGA and CBGA technologies... »»

Design for Manufacture & Assembly Workshop

Conference | Thu, Feb. 24 | Sponsored by: The SMART Group

Design for manufacture (DFM) procedures should be followed if you are making one or one thousand boards. Changing footprints, solder mask apertures, track widths can be done without compromising product reliability... »»

IPC APEX EXPO 2011

Trade Show/Exhibition, Conference | Sun, April 10, 2011 - Thu, April 14 | Sponsored by: IPC

Join thousands of colleagues from more than 50 countries at our industry's premier event � featuring advanced and emerging technologies in printed board design and manufacturing, electronics assembly and test... »»

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Manage programs and schedules from concept to completion, have a full understanding of the product line... »»

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Our successful candidate will preferably have a bachelor�s degree in engineering and experience in our industry... »»

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I have a wide range of experience, from working for a defense contractor to one of the world's largest manufacturers... »»

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Industry Associations Events

SMTA

SMTA - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies. Membership Info | SMTA Certification | Bookstore

Next Event: South East Asia Technical Conference on Electronics Assembly Technologies - May 19


IPC

IPC - Association Connecting Electronics Industries is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly. Membership Info | Training & Certification Programs | Standards & Publications - Online Store

Next Event: Webinar: Interconnect Durability of Package on Package Assemblies - Feb. 22


SMTnet Express
February 17, 2011

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IPC Apex Expo 2011

Newsletter Editor - Anna Girouard, listings(at)SMTnet.com, 1-207-780-0887

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Cost-effective Conformal Coating Machine