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Method of Modeling Differential Vias

Differential Via Structure Through a Multilayer PCB

Method of Modeling Differential Vias

Accurate, models for vias in a multilayer circuit board are necessary to predict link performance in the GHz regime. This paper describes a methodology to build a high bandwidth, scalable first approximation circuit model using simple transmission lines of long vias typically used in thick backplane designs. System architects and backplane designers for example can quickly model various interconnect topologies for what-if scenarios and to set the direction for a more detailed design evaluation.

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Authors:

Lambert Simonovich, Dr. Eric Bogatin, Dr. Yazi Cao,

Organization:

Lamsim Enterprises Inc.

Bogatin Enterprises

Dept. of Electronics, Carleton University

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SMTnet Express
March 17, 2011

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