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Visit the Technical Library... Submit Your Technical Paper...
Visit the Equipment Auctions Calendar...
Even the beginners will reliably and quickly replace leadless device packages such as QFNs or LGAs. Alignment is simple with the edges of the stencil being "squared up" with the sides of the package thereby eliminating the need to use custom fixtures or frames... Visit Used Equipment Mart... Post Your Equipment Listing Free... Excessive solder balls - I have a problem with a large amount of solder balls surrounding mostly the legs of fine pitch ics... UV Tracer in Parylene - Has anyone done any testing with UV tracer in Parylene processing?... Solder problem (bubbles?) - I have a SMD connector that reflow-solders quite poorly. On the X-ray I see strange bubbles... Visit the Forum... Have a Question? Ask for Free... Final Finishes and Their Compatibility with Lead Free Assembly Online Webinar | Thu, August 11 | Sponsored by: SMTA Learn what printed circuit board manufacturers must do to be successful with lead free finishes... Moisture Concerns with PWB Materials Online Webinar | Tue, July 19 | Sponsored by: CALCE The webinar will start with a refresher on printed circuit board fabrication, followed by brief discussion of the moisture transport mechanisms, governing models, and dependent variables.... HiTEN 2011 - High Temperature Electronics Network Conference | Mon, July 18 | Oxford, UK | Sponsored by: IMAPS HITEN provides a conduit for the exchange and dissemination of information on all aspects of high temperature electronics... Visit the Event Calendar... Add Your Event Now...
SMTA Next Event: Capital Expo & Tech Forum - September 13 IPC Next Event: Cleaning Highly Dense Circuit Assemblies & Advanced Packages Webinar - July 19
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SMTnet Express Subscribers: 24844 SMTnet Members: Companies: 8682 Users: 31858 Newsletter Editor - Anna Girouard, listings(at)SMTnet.com, 1-207-780-0887 SMTnet.com, 98 Elm Street, Portland, Maine 04101 USA, Tel.207-780-0887. |
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