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Modelling of Thermal Stresses in Printed Circuit Boards

Results of FEM modelling of thermal stress analysis in printed circuit boards are given in the article.

It is shown that thermal stress alone is not solely caused by differences in coefficients of thermal expansion of individual layers. The emergence of thermal stress is subject to both the layered structure of the wall and given boundary conditions, as well as the existence of a temperature gradient in the direction normal to the surface of the wall...

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Authors: Oldrich Suba, Libuse Sykorova, Stepan Sanda, Michal Stanek

Organizations: Tomas Bata University

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Submit Your Technical Paper...

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Featured auction

Closure of Manufacturing Operations

Thu, October 27 | Online Auction | X-Line Asset Management

Complete Closure of Contract Manufacturing Facility with Equipment as late as 2008

Visit the Equipment Auctions Calendar...

For Sale Online

BEST14ACktTrack Pad Circuit Frame

Tin plated, for epoxy use. Can be used for both tin/lead and RoHS compliant. QTY 1.

Electronic Equipment Mart

UI Genesis 4988C
Chipshooter

CE Exchange

all marketplace listings

Cencorp 1000-BR
Router

Recon

all marketplace listings

Electrovert BRAVO 8
Reflow Oven

PPM

all marketplace listings

Agilent SJ50+
AOI

IBE

all marketplace listings

Visit Used Equipment Mart... Post Your Equipment Listing Free...

Forum

Mounting 0402 chips - We found the misalignment sometime during SMT 0402chips...

Is Trichloroethylene recommended for PCB assembly cleaning? - Can we use TCE for cleaning flux on PCB assembly?...

Reflow Bottom BGA without pallet - We have many PCBA with double side BGA mounted...

Visit the Forum... Have a Question? Ask for Free...

Events

IMPACT 2011 - International Microsystems, Packaging, Assembly and Circuits Technology Conference

Conference | October 19-21 | Taipei, Taiwan | Sponsored by: Taiwan Printed Circuit Association (TPCA)

More than 160 festinating papers originating from 11 countries...

IPC Conference on Reliability: Assembly Process For A Reliable Product

Conference | November 1-2 | Irvine, CA, USA | Sponsored by: IPC

This course is designed for engineers who need to fully comprehend the characteristics of design for reliability (DFR)...

productronica 2011

Conference, Trade Show/Exhibition | November 15-18 | Muenchen, Germany | Sponsored by: Messe M�nchen GmbH

Over 1,200 exhibitors are anticipated to cover more than 830,000 sq. ft. of exhibition space in 7 halls...

Visit the Event Calendar... Add Your Event Now...

Career Center

Jobs:

Field Service Technician

Dallas/Plano, TX, USA | MYDATA automation

Surface Mount Technician-2nd Shift

Zeeland, MI, USA | Gentex Corporation

Test Technician

Appleton, WI, USA | Surface Mount Technology Corp.

Resumes:

Electronics Manufacturing

Brookfield, NY, USA

Electronic Supervisor/Manager

Oak Creek, WI , USA

SMT Process Engineer

Visit Career Center...

Industry Associations Events

SMTA - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies. Membership Info | SMTA Certification | Bookstore

Next Event: LA/OC Expo & Tech Forum - November 2

IPC - Association Connecting Electronics Industries is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly. Membership Info | Training & Certification Programs | Standards & Publications - Online Store

Next Event: IPC Conference on Reliability: Assembly Process for a Reliable Product - November 1-2

SMTnet Express
October 21, 2011

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