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The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array

SMTnet Express June 22, 2012, Subscribers: 25283, Members: Companies: 8903, Users: 33267

The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array

First published in the 2012 IPC APEX EXPO technical conference proceedings.

by: Richard Coyle, Richard Popowich, Peter Read, and Debra Fleming; Alcatel-Lucent, Raiyo Aspandiar, Alan Donaldson, Stephen Tisdale, and Vasu Vasudevan Intel Corporation, Iulia Muntele, Robert Kinyanjui; Sanmina-SCI

Most high reliability electronic equipment producers continue to manufacture and support tin-lead (SnPb) electronic products despite the increasing trend for design and conversion to Pb-free manufacturing. These equipment suppliers can continue to use SnPb solder assembly and remain in compliance with the RoHS Directive (restriction on certain hazardous substances) by invoking the European Union Pb-in-solder exemption. At the same time, companies are facing increased pressure from a component supply chain that is rapidly converting to Pb-free offerings and thus has a decreasing motivation to continue producing SnPb product for these low-volume end users.

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