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New Developments in PCB Laminates

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SMTnet Express July 19, 2012, Subscribers: 25329, Members: Companies: 8927, Users: 33365

New Developments in PCB Laminates

First published in the 2012 IPC APEX EXPO technical conference proceedings.

by: Dean Hattula, John Coonrod; Rogers Corporation, Advanced Circuit Materials Division

With the ever accelerating demands in printed circuit board (PCB) design, the choices of advanced laminate materials have become fewer and fewer. The trends continue towards higher frequency requirements, exotic via structures, shrinking hole to hole pitch, multiple lamination cycles, increased operating temperature, and more stringent environmental regulations for halogen-free and lead-free solder assembly! (...)

Until recently, halogen free laminates struggled with thermal stability as well as poor electrical performance. This paper will outline recent developments for a halogen free laminate system that is unique in regards to these issues.

read article »

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