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Pad Cratering - The Invisible Threat to the Electronics Industry

SMTnet Express September 6, 2012, Subscribers: 25455, Members: Companies: 8972, Users: 33613

Technical Library

Pad Cratering - The Invisible Threat to the Electronics Industry

First published in the 2012 IPC APEX EXPO technical conference proceedings.

by: Chris Hunrath; Integral Technology, Inc.

Pad Cratering opens circuits. This occurs when the resin crack (fracture) migrates through a copper trace or via. This happens at assembly, in service or during handling. When component is removed, PCB copper pad comes with it, leaving behind a "crater" in the PCB. Has become more prevalent with lead free assemblies. Contributing factors include board thickness, size, resin type, CTE of the PCB and component, solder type, component position, assembly conditions post assembly handling...

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Forum search results for related keywords: Pad cratering, BGA, Lead-free solders, Fracture

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September 7 -10, Mumbai, India

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SMTA - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies. Membership Info | SMTA Certification | Bookstore

Next Event: SMTA Webtorial Mastering Selective Soldering Processing and Manufacturability - September 6 - 13


IPC - Association Connecting Electronics Industries is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly. Membership Info | Training & Certification Programs | Standards & Publications - Online Store

Next Event: Electronics Goes Green Conference 2012 - September 13

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Aqueous Technologies Zero-Ion g3

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