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Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints

SMTnet Express September 13, 2012, Subscribers: 25475, Members: Companies: 8976, Users: 33645

Technical Library

Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints

First published in the 2012 IPC APEX EXPO technical conference proceedings.

by: Ward Gatza; Agilent Technologies, Tom Evans; Thomas C. Evans Consulting

Prior to committing production boards to vapor phase soldering, we performed an evaluation to assess reliability and evaluate the vacuum soldering option. The reliability of vapor phase processed BGA solder joints, with and without vacuum applied, was evaluated by means of a test vehicle circuit board assembly. The test vehicle was designed with daisy chain nets through multiple solder joints. These were designed with all of the solder balls in a chain having a similar distance from neutral point, so this factor could be part of the reliability assessment. The boards were temperature cycled for 8250 cycles of -5 to 95�C, by which time all of the outermost daisy chains had failed. The number of cycles-to-failure was analyzed using Weibull plots and characteristic life was calculated...

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Printed Electronics Asia 2012...
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Sept. 19-21, Suntec City, Singapore

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Next Event: Webinar - Stencil Printing Technology and Troubleshooting - September 26


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