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A Novel Material for High Layer Count and High Reliability Printed Circuit Boards

SMTnet Express September 27, 2012, Subscribers: 25503, Members: Companies: 8996, Users: 33716

A Novel Material for High Layer Count and High Reliability Printed Circuit Boards

First published in the 2012 IPC APEX EXPO technical conference proceedings.

by: Jie Wan, Junqi Tang, Xianping Zeng; Shengyi Technology Co., Ltd.

Over the past few years a new family of laminate systems has been developed to face the increasing physical demands of withstanding Pb-free soldering processes used in the assembly of RoHS compliant products. Many of the materials have been found to perform satisfactorily for consumer type products where reflow temperatures peak around 245°C. However the high end PWB designs for the telecommunicat ions and IT equipments typically tend to be more complex, thicker and therefore have a much higher thermal mass than consumer products. In order to apply sufficient heat to enable satisfactory solder reflow of surface mounted devices, the temperature of the printed wiring board can peak at up to 260°C....

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