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Reliability of BGA Solder Joints after Re-Balling Process

SMTnet Express October 4, 2012, Subscribers: 25550, Members: Companies: 9004, Users: 33746

Technical Library

Reliability of BGA Solder Joints after Re-Balling Process

First published in the 2012 IPC APEX EXPO technical conference proceedings.

by: M.H. Biglaria, A. Nazariana, R. Denteneera, M. Biglari, Jra, A.A. Kodentsov; Mat-Tech, Eindhoven University of Technology

Due to the obsolescence of SnPb BGA components, electronics manufacturers that use SnPb solder paste either have to use lead-free BGAs and adjust the reflow process or re-ball these components with SnPb balls. The reliability of Lead-Free and Lead-Containing solder joints for BGA's has been investigated after re-balling using optimal microscopy. The goal was to compare the quality of the connections for both options. For the lead-free BGA, voids produced by the release of volatile species in flux during soldering were present. Large voids have been observed at the interface component/solder...

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Forum search results for related keywords: BGA Reliability, Reballing, Kirkendall, Voiding

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Low Standoff Cleaning - Free Webinar
Oct. 25, Online

electronica 2012...
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SMTA - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies. Membership Info | SMTA Certification | Bookstore

Next Event: Webinar - Design For Environment (DfE) - November 1


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IPC - Association Connecting Electronics Industries is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly. Membership Info | Training & Certification Programs | Standards & Publications - Online Store

Next Event: IPC HDI Conference: Advancements in Materials, Processes and Applications - October 24-25


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