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Wire Bonding and Soldering on Enepig and Enep Surface Finishes with Pure Pd-Layers

SMTnet Express October 11, 2012, Subscribers: 25550, Members: Companies: 9005, Users: 33789

Wire Bonding and Soldering on Enepig and Enep Surface Finishes with Pure Pd-Layers

First published in the 2012 IPC APEX EXPO technical conference proceedings.

by: Mustafa Özkök, Joe McGurran, Dieter Metzger, Hugh Roberts; Atotech

As a surface finish, electroless nickel / electroless palladium / immersion gold (ENEPIG) has received increased attention for both packaging/IC-substrate and PWB applications. With a lower gold thickness than conventional electroless nickel/immersion gold (ENIG) the ENEPIG finish offers the potential for higher reliability, better performance and reduced cost.

This paper shows the benefits by using a pure palladium Layer in the ENEPIG (Electroless Nickel, Electroless Palladium, Immersion Gold) and ENEP (Electroless Nickel, Electroless Palladium) Surface Finishes in terms of physical properties and in terms of gold wire bonding test results.

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