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SMTnet Express March 14, 2013, Subscribers: 26245, Members: Companies: 13310, Users: 34436

Assembly and Reliability of 1704 I/O FCBGA and FPBGAs

by: Reza Ghaffarian, Ph.D.; Jet Propulsion Laboratory, California Institute of Technology

Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administration (NASA) electronic systems. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronic packages. This talk briefly discusses an overview of packaging trends for area array packages from wire bond to flip-chip ball grid array (FCBGA) as well as column grid array (CGA). It then presents test data including manufacturing and assembly board-level reliability for FCBGA packages with 1704 I/Os and 1-mm pitch, fine pitch BGA (FPBGA) with 432 I/Os and 0.4-mm pitch, and PBGA with 676 I/Os and 1.0-mm pitch packages.

First published in the 2012 IPC APEX EXPO technical conference proceedings.

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