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SMTnet Express March 14, 2013, Subscribers: 26245, Members: Companies: 13310, Users: 34436

Technical Library

Assembly and Reliability of 1704 I/O FCBGA and FPBGAs

by: Reza Ghaffarian, Ph.D.; Jet Propulsion Laboratory, California Institute of Technology

Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administration (NASA) electronic systems. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronic packages. This talk briefly discusses an overview of packaging trends for area array packages from wire bond to flip-chip ball grid array (FCBGA) as well as column grid array (CGA). It then presents test data including manufacturing and assembly board-level reliability for FCBGA packages with 1704 I/Os and 1-mm pitch, fine pitch BGA (FPBGA) with 432 I/Os and 0.4-mm pitch, and PBGA with 676 I/Os and 1.0-mm pitch packages.

First published in the 2012 IPC APEX EXPO technical conference proceedings.

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Forum search results for related keywords: ball grid array, BGA, CSP, thermal cycle, solder joint reliability

SMT / PCB Products

iico Pick & Place System (new!)
iico Pick & Place System

For the latest electronic production needs...

by: Europlacer

PCB Cleaning Agent
HYDRON WS 325 Cleaning and Defluxing Agent

For cleaning water soluble flux residues...


Stencil Wipes

The best in class stencil treatment technology...

by: Aculon

SMT Nozzles
and Consumables
Micro Nozzle

High quality replacement parts...

by: Count On Tools

Stencil Printer
SP700avi Inline Stencil Printer

Utilising the most advanced drive...

by: Speedprint

Valor® MSS Asset Utilization Software
Valor MSS Asset Utilization Software for PCB Assembly

Maximize asset utilization...

by: Mentor Graphics

EXCEN High Speed
Modular Mounter
EXCEN High Speed Modular Mounter

World's highest area productivity...


Mark5 Series -
Reflow System
The Mark III Reflow System

Up to 40% reduction in nitrogen consumption...

by: Heller

SMT / PCB Equipment Auctions

Diversified Technology -
SMT Assembly Equipment (285 lots)

Baja Bid - SMT Equipment Auctions

March 25 - 28
auction by: Baja Bid

Complete SMT Facility Closure with 4 Fully Automated Fuji Lines

X-Line - SMT Equipment Auctions

March 19 - 20
auction by: X-Line Asset Management

Electronic Equipment Mart

Heller 1088EXL
Reflow Oven
Heller 1088EXL Reflow Oven

IBE SMT Equipment

all marketplace listings

Screen Printer
DEK 248CE Screen Printer


all marketplace listings

Electrovert Aquajet
Stencil Cleaner
Electrovert Aquajet Stencil Cleaner

JMW Enterprises

all marketplace listings

Panasonic CM-402L A
Panasonic CM-402L A Chipshooter

CE Exchange

all marketplace listings

Events Calendar

Electronics New England
April 10 - 11

Southeast Design-2-Part Show
April 3 - 4

Career Center


Product Manager

San Diego, CA, USA | Nordson ASYMTEK

Equipment & Repair Technician

Suwanee, GA, USA | ASM Assembly Systems

Automated Equipment Operator - Full Time

Indianapolis, IN, USA | Carson Manufacturing


SMT/COB Equipment Engineer

Field Service Engineer

Tucson, Arizona Texas, Florida, Georgia, Alabama, USA

12 Years experience in Equipment, Manufacturing and Technical Support

Open to be relocated

Industry Associations Events


SMTA - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies. Membership Info | SMTA Certification | Bookstore

Next Event: SMTA Webtorial DfM: Challenges & Opportunities - March 21


IPC - Association Connecting Electronics Industries is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly. Membership Info | Training & Certification Programs | Standards & Publications - Online Store

Next Event: IPC/FED Conference on Embedded Components - June 4 - 5

Technical Editor - Davef (submit your technical articles)

Newsletter Editor - Anna Girouard, 98 Elm Street, Portland, Maine 04101 USA, Tel.207-780-0887.

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Capital Equipment Exchange - Used PCB Assembly Equipment

NexJet jetting technology

Advanced SMT Solder Products

Unisoft Software for SMT Placement

Europe's No. 1 source for pre-owned SMT equipment

High Quality SMT Equipment & Feeders Auction

Quality Pre-owned PCBA Equipment

Aqueous Technologies PCB cleaning equipment

PCB Equipment Auctions

IBE - Used SMT Equipment

ii-Feed tape feeding solution for Europlacer machines

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Electronics Equipment Consignment

ITAR and Biomedical Electronic Manufacturing Facility Late-Model SMT Equipment: DEK, MyData, Heller & Nordson (25+) MyData/Agilis Magazines & (250+) Feeders Wave Soldering, Inspection, X-Ray, AOI & More