Recently, the impact of leadless device reliability after rework was investigated as part of a NASA/DoD project for different leadless device rework processes. Leadless device packages, which are challenging to rework due to their large thermal ground planes, low standoff heights from the PCB and the lack of visually inspected criteria, were investigated in terms of their long term reliability after rework. Several leadless device rework methods, including the latest rework procedure (stay in place stencil)1 were investigated in this study. The study, commissioned by Naval Surface Warfare Center (NSWC), Crane Division was attempting to answer the question : "to what extent do rework procedures, including SnPb and lead-free mixed solder joints affect solder joint reliability of high-performance electronics."
SMTA - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.
IPC - Association Connecting Electronics Industries is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.
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