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SMTnet Express, December 11, 2014, Subscribers: 23,586, Members: Companies: 14,135 , Users: 37,386

Technical Library

Failure Modes in Wire bonded and Flip Chip Packages

Hikmat Chammas - Peregrine Semiconductor

The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly processes. Wire bonded packages using conventional copper lead frame have been used in industry for quite some time. However, the demand for consumer electronics is driving the need for flip chip interconnects as these packages shorten the signals, reduce inductance and improve functionality as compared to the wire bonded packages. The flip chip packages have solder bumps as interconnects instead of wire bonds and typically use an interposer or organic substrate instead of a metal lead frame(...)

The integration of these packages in high volume SMT assembly demands good assembly process controls at the package level and clear understanding of the failure modes to minimize defect escape to subsequent assembly operations. This challenge is enhanced with the transition to lead free reflow as the higher peak reflow temperatures results in more thermal and CTE mismatch between package and PWB....

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Forum search results for related keywords: flip-chip, wire bonded.

SMT / PCB Products

X-eye 6200 Auto X-ray Inspection System

Inspection

SEC

SP700avi -
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SP700avi Inline Stencil Printer

Printing

Speedprint

MV-2GT Series -
Desktop AOI Machine

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Mirtec

ZESTRON® EYE
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iico
Pick & Place System

Pick & Place

Europlacer

CELLS - MES & Tracking
Software

Software

Unisoft

CUBE.460 Selective Soldering System

Wave / Selective Soldering

Juki

POWERFLOW series
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Wave Soldering

kurtz ersa

Mark5 Series -
Reflow System
The Mark III Reflow System

Reflow

Heller

Electronic Equipment Mart

Koh Young KY-3020T SPI

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BTU Pyramax 98A Reflow Oven

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X-Line

Essemtec HLX 8100

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AdoptSMT Europe

Quad Parts, Feeders, Nozzles

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Universal Instr. Genesis GX-11D

SMD Placement Machines

CE Exchange

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Events Calendar

PCB Pad Cratering Failures, Test Methods - Causes & Cures Webinar

Online Webinar | January 13 | ASKbobwillis.com - The webinar lasts between 60-90min with questions and answer session...

National Electronics Week 2015

Birmingham, UK | April 21 - 22 | NEW Events Ltd - See the latest technologies, share ideas, be educated and network....

SMT Hybrid Packaging

Online Webtorial | May 5 - 7 | Mesago Messe Frankfurt GmbH - Europe's leading event for System Integration in Micro Electronics...

Career Center

Jobs:

Field Service Engineer

Glassboro, NJ, USA | ESSEMTEC

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Northern CA and WI, USA | Kurtz Ersa Corporation

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Ogden, UT, USA | PCB Solutions, Inc

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SMT Prototyping

Jacksonville, FL, USA

SMT Manager/Operator/Electronics Technician

Tucson, AZ, USA

Industry Associations Events

SMTA

SMTA - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.

Membership Info | SMTA Certification | Bookstore

Next Event: SMTA Empire Networking Event Rochester Amerks vs. Syracuse Crunch - December 17

IPC

IPC - Association Connecting Electronics Industries is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.

Membership Info | Training & Certification Programs | Standards & Publications - Online Store

Next Event: IPC APEX EXPO Conference & Exhibition 2015 - February 24 - 26

Technical Editor - Davef (submit your technical articles)

Newsletter Editor - Anna Girouard

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Aquanox� A8820 water soluble flux cleaner - Kyzen

Used SMT Equipment - IBE

JUKI CUBE.460 - New, Low-cost Selective Soldering System

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