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SMTnet Express, January 5, 2014, Subscribers: 23,708, Members: Companies: 14,158 , Users: 37,476

Technical Library

The Last Will And Testament of the BGA Void

Dave Hillman, Dave Adams, Tim Pearson, Brad Williams, Brittany Petrick, Ross Wilcoxon - Rockwell Collins, Dr. David Bernard, John Travis, Dr. Evstatin Krastev, Vineeth Bastin - Nordson DAGE

The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products.

This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC-9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.

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Events Calendar

BGA Process and Product Failures - Causes and Cures

Online Webinar | January 29 | ASKbobwillis.com - Just like surface mount, the use of BGA's can affect printed board layout, assembly, inspection and repair process. However BGA's provide significant advantages over fine pitch components on assembly yield....

National Electronics Week 2015

Birmingham, UK | April 21 - 22 | NEW Events Ltd - See the latest technologies, share ideas, be educated and network....

SMT Hybrid Packaging

Online Webtorial | May 5 - 7 | Mesago Messe Frankfurt GmbH - Europe's leading event for System Integration in Micro Electronics...

Career Center

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Longmont, CO, USA | A-Tek Systems Group LLC

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Northern CA and WI, USA | Kurtz Ersa Corporation

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Ogden, UT, USA | PCB Solutions, Inc

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SMTA

SMTA - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.

Membership Info | SMTA Certification | Bookstore

Next Event: SMTA Webtorial: Thermal Events: Root Cause Analysis & Prevention for Electronics - January 8 15

IPC

IPC - Association Connecting Electronics Industries is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.

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Next Event: IPC APEX EXPO Conference & Exhibition 2015 - February 24 - 26

Technical Editor - Davef (submit your technical articles)

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