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BGA Process and Product Failures - Causes and Cures, January 29th Webinar by Bob Willis

SMTnet Express, January 28, 2015, Subscribers: 22,279, Members: Companies: 14,195 , Users: 37,607

Technical Library

BVA: Molded Cu Wire Contact Solution for Very High Density Package-on-Package (PoP) Applications

Vern Solberg, Ilyas Mohammed - Invensas Corporation

Stacking heterogeneous semiconductor die (memory and logic) within the same package outline can be considered for less complex applications but combining the memory and processor functions in a single package has compromised test efficiency and overall package assembly yield. Separation and packaging the semiconductor functions into sections, on the other hand, has proved to be more efficient and, even though two interposers are required, more economical. The separated logic and memory sections are configured with the same uniform outline for vertical stacking (package-on-package). The most common configuration places the logic section as the base with second tier memory section soldered to a mating contact pattern.

This paper addresses the primary technological challenges for reducing contact pitch and package-on-package interface technology...

read article »

Forum search results for related keywords: semiconductors, fine pitch, high density.

SMT / PCB Products

Pick & Place System

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PCD Volumetric
Dispense Pumps


GPD Global

Mark5 Series -
Reflow System
The Mark III Reflow System



JTAG Live - PCB Debug Tools



MV-2GT Series -
Desktop AOI Machine



SP700avi -
Stencil Printer

SP700avi Inline Stencil Printer



Quantum™ Large-Format Fluid Dispenser



X-eye SF160FCT
3D CT Analysis



Reflow Oven


BTU International

Pick & Place System

Pick & Place


KIC Auto Focus - Thermal Process Optimization



Aqueous Cleaners



SMT / PCB Equipment Auctions

Exchange Auction - Consign Now

March 4 - 5
X-Line Asset Management

Late Model Conformal Coating Systems & Electronic Manufacturing Equipment

Bids Due: April 30

GoIndustry DoveBid

Electronic Equipment Mart

Heller 1707-EXL
Reflow Oven

Reflow Ovens

IBE SMT Equipment

DEK 265 Horizon
Screen Printer

Screen Printing Equipment

JMW Enterprises

Juki KE 760E With
TD-3D Tray Loader

Pick and Place Equipment


Quad Parts, Feeders, Nozzles

Pick and Place Equipment

PPM Parts

Agilent 5DX Series 3

X-Ray Equipment

CE Exchange

Pick and Place Equipment

Pick and Place Equipment

Shenzhen Tek...

Events Calendar

Pan Pacific Microelectronics Symposium 2015

Koloa, Hawaii, USA | February 2 | SMTA - a premier forum for networking among microelectronics professionals and business leaders throughout the world...

IPC Apex Expo 2015

San Diego, CA, USA | February 22 - 26 | IPC - a five-day event like no other in the printed circuit board and electronics manufacturing industry...

Career Center


Service Engineer

Longmont, CO, USA | A-Tek Systems Group LLC

Service Technician

Northern CA and WI, USA | Kurtz Ersa Corporation

Through Hole Process Engineer / Manager

Ogden, UT, USA | PCB Solutions, Inc


SMT Prototyping

Jacksonville, FL, USA

SMT Manager/Operator/Electronics Technician

Tucson, AZ, USA

Industry Associations Events


SMTA - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.

Membership Info | SMTA Certification | Bookstore

Next Event: SMTA Webtorial: Head in Pillow Causes & Process Solutions - February 5


IPC - Association Connecting Electronics Industries is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.

Membership Info | Training & Certification Programs | Standards & Publications - Online Store

Next Event: IPC APEX EXPO Conference & Exhibition 2015 - February 24 - 26

Technical Editor - Davef (submit your technical articles)

Newsletter Editor - Anna Girouard, 98 Elm Street, Portland, Maine 04101 USA, Tel.207-780-0887.

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Used PCB Assembly Equipment - CE Exchange

IPC Apex Expo 2015

Software for PCB Manufacturing - Unisoft

Fluid Pressure Control - a breakthrough in uniform fluid dispensing - GPD Global

Custom SMT Equipment Nozzles - Count on Tools

PCB Cleaning products - Zestron

Choose an Oven for Your Reflow Needs

3D SMT AOI - Mirtec

SP700avi inline smt screen printer - Speedprint

ii-Feed tape feeding solution for Europlacer machines

Used SMT Equipment

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