With the push for ever improving performance on semiconductor component I/O interfaces, semiconductor components are being driven into a realm which makes them more sensitive to electrostatic discharge, potentially increasing in sensitivity by 50% every 3-5 years. Today, the majority of modern day semiconductor components are being designed to meet 250Volts of charge device model sensitivity, and that could decrease to 125Volts in the next 3-5 years, and could again decrease to 50Volts-70Volts in the following 3-5 years. The entire electronics industry must prepare for this challenge. (...)
The call to action for automated surface mount equipment manufacturers is to start to evaluate, and implement, real-time ESD detection technologies in areas where direct contact with the component (i.e.. pick and place) occurs, and incorporating this real-time detection into their new equipment designs, as well as preparing retrofit kits for existing equipment sets. This is not a trivial task and will require time to develop and implement, so we urge the equipment manufacturing community to begin the process now in preparation for the increase in device sensitivity. In this paper, we will share what has learned about real-time ESD event detection in hopes it aids the equipment manufacturer's preparedness.
SMTA - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.
IPC - Association Connecting Electronics Industries is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.
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