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SMTnet Express, December 10, 2015, Subscribers: 23,782, Members: Companies: 14,767, Users: 39,402

Technical Library

Packaging Technology and Design Challenge for Fine Pitch Micro-Bump Cu-Pillar and BOT (Direct Bond on Substrate-Trace) Using TCNCP

Myung-June Lee - Altera Corporation, SungSoon Park, DongSu Ryu, MinJae Lee - Amkor Technology, Hank Saiki, Seiji Mori, Makoto Nagai - NTK Technologies.

(Thermal Compression with Non-Conductive Paste Underfill) Method.

The companies writing this paper have jointly developed Copper (Cu) Pillar micro-bump and TCNCP(Thermal Compression with Non-Conductive Paste) technology over the last two+ years. The Cu Pillar micro-bump and TCNCP is one of the platform technologies, which is essentially required for 2.5D/3D chip stacking as well as cost effective SFF (small form factor) package enablement. (...)

This paper will address the key challenges of each field, such as the Cu trace design on a substrate for robust micro-joint reliability, TCNCP technology, and substrate technology (i.e. structure, surface finish).

read article »

Forum search results for related keywords: DFM, BOM.

SMT / PCB Products

Printing

Speedprint

Hand Assembly

Virtual Industries

Reflow

Heller

Pick & Place

Count On Tools

Inspection

VJ Electronix

Test

Seika Machinery

Cleaning

ZESTRON

Software

DownStream Tech..

Software

Unisoft

Pick & Place

Europlacer

Dispensing

GPD Global

Inspection

Mirtec

SMT / PCB Equipment Auctions

Complete Late Model SMT Line. (3) Juki Placement Machines & Feeder,s Ekra...

December 14 - 15 | X-Line Asset Management

Online SMT Auction featuring Benchmark Electronics.

December 14 - 16 | Baja Bid

Electronic Equipment Mart

MVP Ultra 850G

AOI

GES Associates LLC

DEK Photon

Screen Printing Equipment

Tekmart

Quad Parts

Pick and Place

PPM Parts

2014 PVA 650

Conformal Coating

X-Line Asset Management

Mirtec MV-3L Tabletop AOI

AOI

IBE SMT Equipment

PCB Conveyors

Conveyors

JMW Enterprises

Essemtec FLX 2020-L

Pick and Place

AdoptSMT Europe

Vitronics XPM3 1240

Reflow Ovens

CE Exchange

Speedline Vectra 450F

Wave Solder Equipment

Baja Bid

Events Calendar

NEPCON JAPAN 2016 - 45th Electronics R&D and Manufacturing Technology Expo

Conference, Trade Show/Exhibition | January 13 - 15 | Reed Exhibitions

Pan Pacific Microelectronics Symposium

Conference | January 25 - 28 | SMTA

5th EFY Expo India 2016

Conference, Trade Show/Exhibition | January 11 - 13 | EFY Enterprises Pvt Ltd

Career Center

Manufacturing Engineer III

Charleston, SC, USA

UEC Electronics

Technical Sales Engineer

San Jose, CA, USA

YINCAE Advanced Materials, LLC.

Sales and Marketing

West Caldwell, NJ, USA

JRE Incorporated

Industry Associations Events

SMTA

SMTA - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.

Membership Info | SMTA Certification | Bookstore

Next Event: Pan Pacific Microelectronics Symposium 2016 - January 25 - 28

IPC

IPC - Association Connecting Electronics Industries is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.

Membership Info | Training & Certification Programs | Standards & Publications - Online Store

Next Event: IPC APEX EXPO 2016 - March 13 - 17

Technical Editor - Davef (submit your technical articles)

Newsletter Editor - Anna Girouard

SMTnet.com, 98 Elm Street, Portland, Maine 04101 USA, Tel.207-780-0887.

Used PCB Assembly Equipment - CE Exchange

Late Model SMT Equipment Auction  - Facility Relocation - 3 SMT Lines

3D CT X-ray Inspection from SEC

CyberOptics - Revolutionary AOI Technology, Unbelievable Speed

Kyzen Free Cleaning Audit

Ready, Set, Jet with Nordson ASYMTEK. New NexJet NJ-8 Jetting System with ReadiSet Jet Cartridge.

Soldertools.net - Rework Tools

Scienscope - Complete PCB Inspection Solutions

ii-Feed intelligent pick and place feeder

Fluid Pressure Control - a breakthrough in uniform fluid dispensing - GPD Global

MIRTEC - the Global Leader in PCB INSPECTION Technology.

Speedprint SP700avi inline SMT screen printer

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