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SMTnet Express, July 6, 2017, Subscribers: 30,558, Companies: 10,626, Users: 23,470

Technical Library

Effects of Package Warpage on Head-in-Pillow Defect

Zhenyu Zhao, Chuan Chen, Yuming Wang, Lei Liu, Guisheng Zou, Jian Cai and Qian Wang - Tsinghua University, Chang Yong Park - Samsung Electronics

Head-in-pillow (HiP) is a BGA defect which happens when solder balls and paste can't contact well during reflow soldering. Package warpage was one of the major reasons for HiP formation. In this paper, package warpage was measured and simulated. It was found that the package warpage was sensitive to the thickness of inside chips. A FEM method considering viscoelastic property of mold compound was introduced to simulate package warpage...

Forum search results for related keywords: warpage, head-in-pillow.


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Technical Editor - Davef (submit your technical articles)

Newsletter Editor - Anna Girouard

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ii-Feed intelligent pick and place feeder

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