Express Newsletter

The SMTnet Express newsletter is sent weekly to over 25,000 subscribers.

SMTnet
»
Express Newsletter

SMTAI 2017 Electronics Manufacturing Conference & Expo

SMTnet Express, September 7, 2017, Subscribers: 30,782, Members: Companies: 10,712, Users: 23,761

Challenges on ENEPIG Finished PCBs: Gold Ball Bonding and Pad Metal Lift

Young K. Song and Vanja Bukva; Teledyne DALSA

As a surface finish for PCBs, Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) was selected over Electroless Nickel/Immersion Gold (ENIG) for CMOS image sensor applications with both surface mount technology (SMT) and gold ball bonding processes in mind based on the research available on-line. Challenges in the wire bonding process on ENEPIG with regards to bondability and other plating related issues are summarized.

See More Equipment & Technology Than Ever Before!

Don't miss your chance to see the latest equipment, materials, and services that can help keep your company competitive. Many of the 170 exhibiting companies will bring working equipment that you can experience for yourself.

Here is some of the equipment you will see at the show:

COATING & DISPENSING

SimpleCoat
Selective Conformal Coating

SMTAI Booth # 216

Nordson ASYMTEK Spectrum� II Automated Dispenser with AOI

SMTAI Booth # 515

PRINTING & PLACEMENT

Speedprint SP710avi
Screen Printer

SMTAI Booth # 224

Europlacer iineo+ Multi Function Pick and Place

SMTAI Booth # 1015

SOLDERING

Heller Mark 5 Reflow Oven

SMTAI Booth # 407

KIC Smart Factory Profiling Solutions

SMTAI Booth # 123

Shenmao Soldering Materials

SMTAI Booth # 534

BTU Pyramax Reflow Oven

SMTAI Booth # 430

CLEANING

ZESTRON HYDRON�, Single-phase PCB Cleaning Agents

SMTAI Booth # 215

KYZEN ANALYST, Automatic, Real-time Concentration Analytics System

SMTAI Booth # 615

TEST / INSPECTION

MIRTEC MV-3 OMNI Desktop 3D AOI with 15 Megapixel CoaXPress Camera Technology

SMTAI Booth # 616

CyberOptics SQ3000� 3D AOI with Ultra-High Resolution Multiple-Reflection Suppression (MRS) Sensor

SMTAI Booth # 1416

REWORK

Metcal CONNECTION VALIDATION™, The Next Generation of Soldering

SMTAI Booth # 208

PDR IR-E3M Micro Component/PCB Rework System

SMTAI Booth # 233

Virtual Industries Vacuum Tweezers, Easily Handle Small Parts

SMTAI Booth # 235

PACE Low-Cost Convective and Infrared Rework System

SMTAI Booth # 127

OTHER

STI Engineering, Training Services

SMTAI Booth # 818

HEPCO Lead Forming Equipment

SMTAI Booth # 412

FKN Systek PCB Depanelizers

SMTAI Booth # 115

What else is going on in the exhibit hall?

SMTA International Conference

The conference features 20 workshops, 130 technical papers, and numerous complimentary offerings for engineers and professionals in the electronics manufacturing industry. Technical tracks will cover Advanced Packaging Technology; Manufacturing Excellence - process and assembly; Substrates/PCB Technology; Flux, Solder and Adhesives; and Inspection Technologies. Engineers from major manufacturing companies like Celestica, Flex, IBM, Intel, Lockheed Martin, Sanmina Corporation, and several universities will present their latest research on critical process improvements, new materials and technologies.

Tech Tours!

Back by popular demand! This is an opportunity to participate in technology focused tours that showcase the latest equipment and solutions in a small group setting with no sales pressure. Subject areas will be new products and test equipment. Our exhibiting partners will provide a demo of their equipment and a short technology-based presentation.

Appreciation Reception

The Appreciation Reception is open to all SMTAI attendees and will be held on Wednesday, September 20 at 3:30pm in the Exhibit Hall Courtyard. This event is to celebrate chapter accomplishments and successes as well as to recognize the speakers and exhibitors who have loyally participated and supported SMTA events over the past year. Please come and share in the celebration!

Special thanks to our Premium Sponsor!