Torsten Geipel, Achim Kraft, Ulrich Eitner - ISE, Monja Moeller - Kiel University
Intermetallic compounds (IMC) in solder bonds are commonly considered critical for the reliability of interconnections. The microstructure and thermal aging characteristics of solder bonds of crystalline silicon solar cells are investigated, whereby two solders, Sn60Pb40 and a lead-free, low melting point alternative Sn41Bi57Ag2 are considered.
productronica 2017 - the future of electronics production
The world's leading trade fair productronica, which takes place at Messe Munchen from November 14-17, 2017 will show you what the future of electronics development and production will look like.
Besides robotics and miniaturization, the fair's focal points include semiconductor solutions and digitalization. With your ticket you may also visit the concurrent fair SEMICON Europe in addition to productronica.
SMTA - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.
IPC - Association Connecting Electronics Industries is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.
