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SMTnet Express, December 16, 2017, Subscribers: 31,015, Companies: 10,789, Users: 24,054

Technical Library

Controlling Voiding Mechanisms in the Reflow Soldering Process

Keith Sweatman, Takatoshi Nishimura, Kenichiro Sugimoto, Akira Kita; Nihon Superior Co., Ltd.

While a significant level of voiding can be tolerated in solder joints where electrical conductivity is the main requirement, voiding at any level severely compromises thermal conductivity. For example, in LED lighting modules effective conduction of heat through the 1st level die attach to the substrate and then through the 2nd level attach to the heat sink is critical to performance so that voiding in the solder joints at both levels must be minimized. (...) In this paper, the authors will review the factors that influence the incidence of voids in small and large area solder joints that simulate, respectively, the 1st and 2nd level joints in LED modules and discuss mitigation strategies appropriate to each level. They will also report the results of a study on the effect on the incidence of voids of flux medium formulation and the optimization of the thermal profile to ensure that most of the volatiles are released early in the reflow process.

Forum search results for related keywords: voids. void reduction, reflow soldering.

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Virtual Industries

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BEST, Inc.

SMT / PCB Equipment Auctions

Repair and Test Lab Equipment

December 5 - 7 | X-Line

Sealed Bid Auction
Featuring Items From Wyndsor Lighting

Nov. 13 - Dec. 8 | Baja Bid

Electronic Equipment Mart

Speedline MPM AP EXCEL

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Capital Equipment Exchange

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KD Electronics Ltd.

Assembleon MC1

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Recon Inc

Events Calendar

Space Coast Expo & Tech Forum | January 2018 | SMTA

X-Ray of PCBs Webtorial | December 6 - 13 | BEST Inc.

Technology Seminar - a new low melting point solder alloy that improves quality, lowers costs and maximizes equipment efficiency | December 6 and December 7 | kurz ersa

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Soldering & PCB Rework Courses

Career Center

Senior Design Engineer

Murphy, NC

Aegis Power Systems

Industry Associations Events

SMTA

SMTA - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.

Membership Info | SMTA Certification | Bookstore | Upcoming Events

IPC

IPC - Association Connecting Electronics Industries is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.

Membership Info | Training & Certification | Online Store | Upcoming Events

Technical Editor - Davef (submit your technical articles)

Newsletter Editor - Anna Girouard

SMTnet.com, 98 Elm Street, Portland, Maine 04101 USA, Tel.207-780-0887.

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Used PCB Assembly Equipment - CE Exchange

BTU Pyramax reflow oven - global standard of excellence for SMT reflow, semiconductor packaging and LED packaging and assembly.

SMT Eequipment & Parts - Recon

Fast INSPECTION & automatic COMPONENT REEL COUNTING with XQuik AccuCount - Compact X-Ray system

PCB Cleaning products - Zestron

Europlacer iineo+ SMT pick and place with integrated component tester

Kyzen Free PCB Cleaning Audit

Dual Applicators for Non-Atomized Conformal Coating Improve High-Volume Manufacturing

Quality Pre-Owned SMT Eequipment - Robo-Tek

Soldertools.net - Rework Tools

Fluid DISPENSING pumps for integration into your system - GPD Global

Vacuum Tweezers - pick up small components with ease

HELLER - Choose an Oven for Your Reflow Needs

KIC - Making Reflow Ovens Smarter

MIRTEC MV 6 OMNI High-Speed / High-Performance 3D AOI

Used SMT Equipment - IBE

Speedprint SP700avi inline SMT screen printer

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