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SMTnet Express, November 22, 2017, Subscribers: 31,034, Companies: 10,792, Users: 24,082

Technical Library

Factors Affecting the Adhesion of Thin Film Copper on Polyimide

David Ciufo, Hsin-Yi Tsai and Michael J. Carmody; Intrinsiq Materials Inc.

The use of copper foils laminated to polyimide (PI) as flexible printed circuit board precursor is a standard practice in the PCB industry. We have previously described[1] an approach to very thin copper laminates of coating uniform layers of nano copper inks and converting them into conductive foils via photonic sintering with a multibulb conveyor system, which is consistent with roll-to-roll manufacturing. The copper thickness of these foils can be augmented by electroplating. Very thin copper layers enable etching fine lines in the flexible circuit. These films must adhere tenaciously to the polyimide substrate.

In this paper, we investigate the factors which improve and inhibit adhesion. It was found that the ink composition, photonic sintering conditions, substrate pretreatment, and the inclusion of layers (metal and organic) intermediate between the copper and the polyimide are important.

Forum search results for related keywords: copper foil. laminate.

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Space Coast Expo & Tech Forum | January 2018 | SMTA

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SMTA - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.

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Technical Editor - Davef (submit your technical articles)

Newsletter Editor - Anna Girouard

SMTnet.com, 98 Elm Street, Portland, Maine 04101 USA, Tel.207-780-0887.

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