Saminda Dharmarathna, PhD, Ivan Li, PhD, Maddux Sy, Eileen Zeng, Bob Wei, William Bowerman, Kesheng Feng, PhD; MacDermid Inc.
The electronics industry has grown immensely over the last few decades owing to the rapid growth of consumer electronics in the modern world. New formulations are essential to fit the needs of manufacturing printed circuit boards and semiconductors. Copper electrolytes for high throwing power applications with high thermal reliability and high throughput are becoming extremely important for manufacturing high aspect ratio circuit boards.
Here we discuss innovative DC copper metallization formulations for hoist lines and VCP (Vertical Continues Plating) applications with high thermal reliability and throughput for high aspect ratio PCB manufacturing
SMTA - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.
IPC - Association Connecting Electronics Industries is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.
