Voiding in solder joints has been studied extensively, and the effects of many variables compared and contrasted with respect to voiding performance. Solder paste flux, solder powder size, stencil design, circuit board design, via-in-pad design, surface finish, component size, reflow ...
Voiding in bottom termination components (BTCs) like QFNs and LGAs have become quote the hot topic in the SMT industry. Surprisingly, one type of BTC component that is observed to have excessive amounts of voiding is the DPAK. One would think that a component with leads ..
A new case for the ASA EyePoint u21 was developed.
Our updated, single-channel, miniature version of the manual locator of faulty electronic components - EyePoint u21, will be on sale soon!
The EP u21 is a simple, compact, programmable benchtop instrument, the youngest in the EyePoint line. The device remained in the same configuration, but got a new metal case.... | Engineering Physics Center of MSU
The unforgettable year is coming to an end, at this special time, we ETA sending our sincerest blessings to friends at home and abroad. Wish all brothers and sisters work happy and enjoy life.... | Shenzhen ETA Electronic Equipment Co. LTD.
SMTA - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.
IPC - Association Connecting Electronics Industries is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.