Package-on-Package (PoP) is a popular technology for fabricating chipsets of accelerated processing units. However, the coefficient of thermal expansion mismatch between Si chips and polymer substrates induces thermal warpage during the reflow process. As such, the reflow temperature and reliability of solder joints are critical aspects of PoP. Although Sne58Bi is a good candidate for low-temperature processes, its brittleness causes other reliability issues. In this study, an in-situ observation was performed on composite solders (CSs) made of ...
Developing actuators to drive high-frequency jetting dispensers in the dispensing technology for electronic assembly applications has become a concern in recent years. This study proposed a new jetting dispenser without a displacement amplification mechanism directly actuated by a moving magnet actuator (MMA) to jet small fluid droplets. In this article, the main geometric dimensions of ...
Logicomm on GSM --
I am trying to look at logicomm messages on my gsm machine but I don't seem to be doing something correctly. I don't see any messages or have any prompt in the logicomm.exe window, just a black screen with a flashing cursor.
Manchester, NH ��� January 30, 2019 ��� Leo Lambert, Vice President and Technical Director at EPTAC Corporation has been given the highest IPC Honor, The Raymond E. Prichard Hall of Fame Award for his extraordinary contributions to the electronics industry and the IPC. Leo received this award and induction during the IPC APEX EXPO in San Diego during which Leo's longstanding achievements were spotlighted.... | EPTAC Corporation
MIRTEC announce that European Circuits Limited purchased an MV-3 OMNI Desktop 3D AOI Machine. The purchase was facilitated through Bentec Ltd.... | MIRTEC Corporation
Nihon Superior Co. Ltd. is pleased to announce its 55th year in business. Toshiro Nishimura, Chairman and founder, started the company by importing brazing alloys and supplying them to Japanese companies in the metal-joining industry.... | Nihon Superior Co., Ltd.
SMTA - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.
IPC - Association Connecting Electronics Industries is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.