Sn-based lead-free solders such as Sn-Ag-Cu, Sn-Cu, and Sn-Bi have been used extensively for a long time in the electronic packaging field. Recently, low-temperature Sn-Bi solder alloys attract much attention from industries for flexible printed circuit board (FPCB) applications. Low melting
The 2017 iNEMI Board and Assembly Roadmap forecasts that, due to economic, environmental and technical drivers, use of low temperature solder pastes will increase significantly and reach 10% of all solder paste used for board assembly by 2021.
Low temperature solder alloys are preferred for the assembly of temperature-sensitive components and substrates. The alloys in this category are required to reflow between 170 and 200oC soldering temperatures. Lower soldering temperatures result in lower thermal stresses and defects, such as ...
vacuum reflow -- Hi, are there any component types that are not suitable for vacuum reflow ? I've had one customer use his vacuum vapour phase reflow system on a pcb, and on 10% of the hermetically sealed accelerometers devices. the lids have popped off... Thanks Graham
A3D AOI -- Hi, I'm currently in the process of evaluating a number of 3D AOI machines such as Koh Young Zenith Alpha HS+, CyberOptics SQ3000, Mirtec MV-6 Omni, Parmi Xceed L and Aleader ALD8720S. Does anyone have any thoughts on these machines as to which is best for a high mix/low volume CEM? Any other machines should be considered? Thanks
SMTA - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.
IPC - Association Connecting Electronics Industries is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.