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XTECH Auctions ��� Sep 14 ��� 16, 2021 Auction Announcement

SMTnet Express, September 2, 2021, Subscribers: 26,737, Companies: 11,436, Users: 26,825

Technical Library

Tombstoning Of 0402 And 0201 Components: "A Study Examining The Effects Of Various Process And Design Parameters On Ultra-Small Passive Devices"

The long-standing trend in the electronics industry has been the miniaturization of electronic components. It is projected that this trend will continue as Original Equipment Manufacturers (OEMs) and Electronic Manufacturing Service (EMS) providers strive to reduce "real estate" on printed circuit boards. Typically, the miniaturization of components can be achieved by integration or size reduction. At present, size reduction is considered to be more cost effective and flexible than integration. Passive components, which are used in limiting current, terminating transmission lines and de-coupling switching noise, are the primary focus in size reduction due to their variety of uses.

Credits: Plexus Corporation

Solving Surface-Mount Assembly Challenges Presented by 0201mm Components

The global electronics industry's ability to deliver seemingly limitless ongoing advancements in product capabilities has encouraged an insatiable consumer demand for more, better, and smaller. Demands for high functionality of mobile devices, smart watches, military, medical, audio, and wearable technology continue to drive requirements for miniaturisation.

Credits: Yamaha Motor IM America, Inc.

Investigating the Metric 0201 Assembly Process

The advance in technology and its relentless development is delivering yet another surface mount assembly challenge. To meet the market demand for products with higher functionality whilst reducing the overall product size, the next generation of chip package is being readied upon the surface mount community. The Metric 0201 will have dimensions in the order of 0.25mm x 0.125mm, as a result the entire assembly process will be questioned as to its ability to deliver high volume/quality product.

Credits: ASM Assembly Systems (DEK)

Stencil Printing 008004/0201 Aperture Components

This paper will focus on the application requirements of solder printing small aperture designs, concentrating on 008004 (inch) / 0201 (metric) size components, and the results of a design of experiment printing these challenging apertures. As Moore's law continues to be applied to component miniaturization, the next installment of reduced packaging has arrived in the form of the 008004/0201 for resistors and capacitors. Component size roughly the size of a grain of sand presents specific challenges to the solder printing process. To address these challenges, each aspect of the printing process will need be examined. This includes ...

Credits: ITW EAE

Forum search results for related keywords: 0201: 579

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Electronics Forum

CKD VP-1000 VPHost Offline Programming Software -- Is there anyone out in the community that has an old copy of the CKD VPHost software that's compatible with the old VP-1000 system? This was a software that ran on Windows XP. Looking to obtain a usable copy. Any help would be appreciated. Thanks!

Views: 206

AXI (X-Ray) skip X-out board -- Hi Experts, I'm looking for how to auto skip the AXI(X-Ray) inspection on X-out board,Did any folks have the experience on this? Looking for your advice. AXI machine,Virtox and Matrix - Thank you

Views: 375

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SMT, PCB Electronics Assembly Manufacturing News

North American EMS Industry Down 2.9 Percent in July

IPC Releases EMS Industry Results for July 2021... | IPC

IPC Releases EMS Industry Results

Koh Young Speaking at the Hybrid eSMART Factory Conference on 22 and 29 September 2021 in Coventry, UK

Atlanta, GA - As a firm believer in the power of a smart factory, Koh Young, the industry leader in True3D™ measurement-based inspection solutions, is a session speaker and Platinum Sponsor at the upcoming eSMART Factory Conference on 22 and 29 September 2021 in Coventry, United Kingdom. The first day is an .... | Koh Young America, Inc.<

Koh Young Speaking at the Hybrid eSMART Factory Conference

Indium Corporation Expert to Present at SiP Conference China

Shrinking stencil apertures and gaps between padshave necessitated more critical solder paste printing requirements. Indium Corporation expert Leo Hu, senior area technical manager, will cover these conditions and more when he presents on finefeature solder paste printing for heterogeneous integration assembly at SiP Conference China, Sept. 27-29, Shenzhen, China.... | Indium Corporation

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Industry Associations Events


SMTA - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.

Membership Info | SMTA Certification | Bookstore | Upcoming Events


IPC - Association Connecting Electronics Industries is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.

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Editor - Dave "davef" Fish (submit your technical articles), 98 Elm Street, Portland, Maine 04101 USA, Tel.207-780-0887.


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