Hanwha HM510 Pick and Place Machine High Speed: 60,000 CPH Placement Accuracy:±40 μm @ Cpk ≥ 1.0 (Chip) / ±30 μm @ Cpk ≥ 1.0 (IC) Component Range:0402 ~ 55 mm Spindles: 6 spindles x 2 Gantry Hanwha HM510 Pick and Place Machine Hanwha HM510 P
JUKI Nozzle for 700&2000 series KD775&780E3401-802-000JUKIKD775 DISP NZ S2D/1S 0.6/0.3P=0.7E3406-802-00JUKI KD775 DISP NZ M1D/2S 0.7/0.4P=1.0E3411-802-000JUKI KD775 DISP NZ L1D/1S 0.9/0.6P=1.5E3416-802-000JUKI KD775 DISP NZ LL 2D/2S 0.9/0.6P=1.5E342
Electronics Forum | Mon Feb 04 12:28:28 EST 2008 | jseagle
1.0mm (0.039") 1.75X >0.5 to 1.0mm (0.02 to 0.039") 4X 0.25 to 0.5mm (0.00984 to 0.02") 10X
Electronics Forum | Tue Apr 19 09:06:51 EDT 2005 | russ
1005 breaks down like this in mm. the "10" equals 1.0 mm, the "05" equals 0.5mm so, 1005. in inch conversion 1.0mm = .04", 0.5mm = .02" so 0402 (.04" x.02" = 1.0 x 0.5). Hope this helped.
Used SMT Equipment | Pick and Place/Feeders
OS: Windows XP SW: 8.5.5.1 Lightning Feature Cameras: OTHC (Narrow fov) beam 1 firewire 1394 .55 per pixel. OTHC (Narrow fov) beam 2 firewire 1394 .55 per pixel. Pecs: pec beam1 firewire 1394 1.0 mil per pixel. pec beam 2 firewire
Used SMT Equipment | Pick and Place/Feeders
Serial: 10101112 Windows XP SW: 8.5.5.1 Lightning Feature Cameras: OTHC (Narrow fov) beam 1 firewire 1394 .55 per pixel. OTHC (Narrow fov) beam 2 firewire 1394 .55 per pixel. Pecs: pec beam1 firewire 1394 1.0 mil per pixel
Industry News | 2003-04-29 08:27:33.0
Emerson Energy Systems is using Weidmuller's Minimate S2L/B2L PCB connector for its IMT 2000 multifunction unit, thanks to its space saving design and competitive price.
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Parts & Supplies | Pick and Place/Feeders
Part Name：TAPE GUIDE ASSY CP6/CP7/CP8/XP ø1.0～ø1.8 Part No：AKJAC 9080
Technical Library | 2015-05-14 15:45:45.0
The Printed Circuit Board industry has seen a steady reduction in pitch from 1.0mm to 0.4mm; a segment of the industry is even using or considering a 0.25mm pitch. This has increased the use of stacked microvias in these designs. The process of stacking microvias has been practiced for several years in handheld devices; however, the devices generally do not operate in harsh conditions. Type 1 and Type 2 microvias have been tested over the years and have been found to be very reliable. We do not have enough test data for 3 and 4 stack microvias when placed on and off buried via. The main objective of this study was to understand the reliability of 3 and 4 stack microvias placed on and off a buried via.
Technical Library | 2013-03-14 17:19:28.0
Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administration (NASA) electronic systems. Understanding the process and quality assurance (QA) indicators for reliability are important for low-risk insertion of these advanced electronic packages. This talk briefly discusses an overview of packaging trends for area array packages from wire bond to flip-chip ball grid array (FCBGA) as well as column grid array (CGA). It then presents test data including manufacturing and assembly board-level reliability for FCBGA packages with 1704 I/Os and 1-mm pitch, fine pitch BGA (FPBGA) with 432 I/Os and 0.4-mm pitch, and PBGA with 676 I/Os and 1.0-mm pitch packages. First published in the 2012 IPC APEX EXPO technical conference proceedings.
Events Calendar | Thu Dec 05 00:00:00 EST 2019 - Thu Dec 05 00:00:00 EST 2019 | ,
Webinar: Update on New IPC-1752B Supply Chain Standard — Preparing for Submissions to the ECHA SCIP Database
Events Calendar | Thu Aug 31 00:00:00 EDT 2017 - Thu Aug 31 00:00:00 EDT 2017 | Shenzhen, China
NEPCON and Smart Factory 1.0—The Future of Electronics Manufacturing
Career Center | New Delhi, India | Engineering,Maintenance,Management,Production,Quality Control,Sales/Marketing
Embedded System: 8085 Microprocessor, 8051Microcontrollert, 16 bit Renesas Microcontroller, ARM7, UART, RS-232, IR Sensor, Hall Sensor, Fingerprint Module, RF Module, EEPROM and GSM. VLSI, VHDL. Software’s Knowledge: Keil3, Flash Magic, Prog5
Career Center | Palm Bay, Florida USA | Engineering,Production
1 year of SMT production experience in a low/med volume, high mix environment. IPC-A-610 Certified Specialist. Reflow profiling experience Heavy CAM programming experience with prototypes and new products
Heller Industries Inc. | https://hellerindustries.com/parts/95537m/
95537M - M6-1.0 X 25MM SHCS Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
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Solder Wire S03X7Ca-72M - 1.0 mm - PCBASupplies Login Create Account Contact View My Cart Menu × Categories Hand Soldering & Rework Automation Tooling PCB Support Systems Soldering Robots Material Handling Dry Storage Cabinets Component Handling Selective Solder Nozzles Pick
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