Partner Websites: .275-.500 (164)

Case study: How to Create a Reflow Profile for a 16-layer, 2mm Thickness PCB with a High Density SMT

| http://etasmt.com/cc?ID=te_news_industry,23961&url=_print

High Speed High Density Open Pin Field Array, has up to 500 I/O contact pins with a solder charge termination. This type of connector looks like a standard BGA type of SMT device

Unisoft XML export definitions specifications | Unisoft

| https://unisoft-cim.com/exports_xml-definition.html

="1519" y1="869" x2="1119" y2="931"/> 500" y="-500" rotation="0" devicetype="SMD" partno="MOIRE" layer="BOTTOM">


.275-.500 searches for Companies, Equipment, Machines, Suppliers & Information

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Fluid Dispensing, Staking, TIM, Solder Paste

Training online, at your facility, or at one of our worldwide training centers"
Thermal Interface Material Dispensing

World's Best Reflow Oven Customizable for Unique Applications
Electronic Solutions

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
PCB Handling with CE

Best Reflow Oven


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