Industry Directory | Consultant / Service Provider / Manufacturer
custom manufacturer of miniature electronic connectors based on fine line flex circuitry with 0,025mm conductors on 0,05mm pitch.
Industry Directory | Consultant / Service Provider
Samtec is recognized as the service leader in the connector industry. Most Samtec products fall into one of three categories: high speed (signal integrity), micro pitch, and rugged/power products.
New Equipment | Rework & Repair Equipment
Visit PSI's main BGA Reballing Services page for more information. PSI has over 20 years experience reballing BGA devices of every size, pitch, and package style: micro-BGAs Alloy conversion from Sn/Pb to Pb-free, or Pb-free to Sn/Pb Reclaim a
New Equipment | Rework & Repair Services
Many Fortune 500 clients, and numerous other OEMs and contract manufacturers of micro-electronics rely on Process Sciences to service, modify, reclaim, upgrade, and/or repair their circuit assemblies and array devices. PSI knows solder! Please rememb
Electronics Forum | Tue Dec 11 12:29:57 EST 2012 | deanm
Thanks for the comments so far. The smallest nozzle I've tried is a 4mm, which is what Pillarhouse used on this board to provide a sample. I tried this but wasn't as good as the 6mm. I've soldered the same connectors on a different board using a 10mm
Electronics Forum | Fri Apr 27 08:19:04 EDT 2012 | jim_n_hky
Can anyone offer guidelines on DFM and process recommendations for soldering .050" pitch connectors in the wave. The initail design had .026" drill with .043" pads so only .007" between pads. I requested .035" pads, but this still only leaves .015" b
Used SMT Equipment | SMT Equipment
accuracy :CHIP :±0.08mm;IC :±0.04mm unit range:8mm-72mm Strip, bulk material, with tray Model :JUKI KE-2020 name:Universal placement equipment,With IC cabinet ,high accuracy ,stable,suitable for all kinds of unit components with 5 heads conditio
Used SMT Equipment | SMT Equipment
accuracy :CHIP :±0.08mm;IC :±0.04mm unit range:8mm-72mm Strip, bulk material, with tray Model :JUKI KE-2020 name:Universal placement equipment,With IC cabinet ,high accuracy ,stable,suitable for all kinds of unit components with 5 heads conditio
Industry News | 2003-05-23 08:24:49.0
Solid cables of up to 35mm2 cross-section now can be connected to PCBs easily, reliably and cost-effectively with the new Power Combicon range of connectors.
Industry News | 2003-07-08 09:22:20.0
A new range of coding profiles for Combicon wire-to-board connectors aims to avoid the pitfalls of inserting the wrong plug into a header when making plug-in connections to a PCB.
Parts & Supplies | Pick and Place/Feeders
Juki CF03HPR FEEDER 0201 Specs: 40081758 CF03HPR 8mm TAPE FEEDER UNIT FOR 0603 40081759 CF05HPR 8mm TAPE FEEDER UNIT FOR 1005 40081760 CF08HER 8mm TAPE FEEDER UNIT (2MM PITCH) 40081761 CF081PR 8mm TAPE FEEDER UNIT 40081762 CF081ER 8
Parts & Supplies | Pick and Place/Feeders
Juki CF03HPR FEEDER 0201 Specs: 40081758 CF03HPR 8mm TAPE FEEDER UNIT FOR 0603 40081759 CF05HPR 8mm TAPE FEEDER UNIT FOR 1005 40081760 CF08HER 8mm TAPE FEEDER UNIT (2MM PITCH) 40081761 CF081PR 8mm TAPE FEEDER UNIT 40081762 CF081ER 8
Technical Library | 2015-08-27 15:32:16.0
Ever since there has been a widespread usage of surface mount parts, the trend of continued shrinkage of devices with ever finer pitches has continued to challenge PCB assemblers for the rework of same. Todays' pitches are commonly 0.5 to 0.4mm with packages of tiny outline sizes, 5 -10mm square, making the rework of such devices a challenge. In addition to the handling and inspection challenges comes the board density. Spacing to neighboring components continues to be compressed so the rework techniques should not damage neighboring components.
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
ITW EAE, the Electronic Assembly Equipment division of ITW is introducing an innovative new twin-nozzle developed by the Vitronics Soltec team for the ZEVA Selective Soldering System. The 3D-Twin-Nozzle™ has two nozzle diameters combined in one
Events Calendar | Thu Mar 18 00:00:00 EDT 2021 - Thu Mar 18 00:00:00 EDT 2021 | ,
India Chapter Webinar: PCBA Process Qualifications
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Career Center | Gwinnett County, Georgia USA | Production
SHIFTS: 1st and 2nd Shifts (Over-Time as required) STATUS: Indefinite Temporary PAY: $11.00-$12.00 per hour JOB DESCRIPTION • Perform SMT soldering, desoldering, rework, and assembly of fine pitch electronic components on Printed Circuit Boards (PCB
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
SMTnet Express, December 31, 2015, Subscribers: 23,946, Members: Companies: 14,865, Users: 39,660 Study on Solder Joint Reliability of Fine Pitch CSP Yong Hill Liang, Hank Mao, YongGang Yan, Jindong (King) Lee; AEG, Flex (Flextronics International
Baja Bid | https://bajabid.com/wp-content/uploads/2021/05/MY300-SX-Brochure.pdf
° IPC 9850 fine pitch repeatability 3 (X, Y, Theta) (4) 21 μm, 0.05° IPC 9850 fine pitch accuracy @ Cpk = 1.33 (X, Y, Theta) (4, 5) 35 μm, 0.09° SYSTEM FEATURES MY300SX On-the-fly mount order optimization Vision autoteach with snap-to-grid Automatic illumination settings Intelligent feeder concept
Lewis & Clark | https://www.lewis-clark.com/shop/page/4/
: 13.5″ x 22″ Smallest Component Capacity: 0201 Components Largest Component Size: 1.96″ Square Body Placement Accuracy: ±0.001″ (0.025mm) Max Placement Rate: 3000 cph Fine Pitch Capability
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