The 3rd-generation M3 multi-function chip mounter implements high speed, stability and accuracy operation. The system meets the high-density, miniaturization, multi-encapsulation, large capacity, high precision characteristics requirement of LED fiel
New Equipment | Coating Materials
Our conductive non-woven fabric is plated Cu+Ni on non-woven fabric,it has good conductivity and shielding effectiveness,it is widely used in various electronic products.The thickness of our non-woven fabric is 0.035mm,0.045mm,0.04mm,0.08mm,0.10mm,0.
Electronics Forum | Wed May 05 15:31:14 EDT 2021 | edhare
0.5 to 1 micron is typically too thick and can result in gold embrittlement of the solder joint. Typical IG thickness is 0.18 microns. see https://www.semlab.com/papers/gold-embrittlement-of-solder-joints/ Ed Hare
Electronics Forum | Tue Apr 29 11:18:16 EDT 2008 | julienvittu
basically your problems come from the copper balance top and bottom side we are using substrate down to 0.18mm (semiconductor industry/ Bga package / SIp business) you have to respect 5% difference maximum between Top and bottom side otherwise you
Used SMT Equipment | SMT Equipment
Name:YS12F Placement Speed: 20000cph(0.18sec/chip) Placement Station:47 PCB Dimensions: 510*460 Accuracy: ±0.05mm Power Supply:3 PH, 200-415V Machine Dimensions: 1254*1755*1450 Weight: 1370kg
Used SMT Equipment | SMT Equipment
Name:YV100Xgp Placement Speed:20000cph(0.18sec/CHIP Equivalent) Placement Range:0603(Metric base )to□31mm Power Supply:AC220V-380V(50/60HZ) Dimensions:L1650XW1408XH1425mm Weight:1580kg
Industry News | 2003-02-20 08:04:10.0
The Mini-Fix card-to-cable connector is designed to withstand hundreds of mating cycles with high contact security and mechanical stability.
Industry News | 2002-04-24 08:40:56.0
Under the Terms, SMIC will Join IMEC's Industrial Affiliation Programs (IIAPs)
Parts & Supplies | Assembly Accessories
Product name: YV100XG YAMAHAmulti-functional chip mounter Product number: YV100XG Products in detail YAMAHA multi-function chip mounter YAMAHAYV100XG High speed and high precisionmulti-function modular placement machine 0.18 seconds/CHIP ul
Parts & Supplies | Chipshooters / Chip Mounters
Part Number Description KHN-M7710-A1X 301A 0.8x0.7(X) KHN-M7720-A1X 302A 1.7x1.0 KHY-M7740-A0X 303A (314A)Φ4.0/3.0/2.0 KHY-M7750-A0X 304A (315A)3.1x1.1(O-ring) KHY-M7760-A0X 305A (316A)O-ring KHY-M7770-A0X 306A (317A)Mel
Make: Universal Model: Genesis GI-07S – 4992C (With PTF) Vintage: 2012 SW: UPS+ 8.3.0.10. Details: • Linear X/Y • 7 spindle head • Nozzle changer • Magellan 2.3 camera • PTF mounted on rear Visit www.lewis-clark.c
Panasonic CM602-L high-speed module placement machine, CM602-L placement machine not only follows the original module of Panasonic CM402, but also adds 12 nozzle high-speed head and direct suction tray as needed. The function of the original 8 nozzle
