We manufacture multi PCB up to 12 layer,The details of our capabilities:*Micro fine line to 4 mil *Blind & buried via hole *Flying-probe testing *Carbonlack *FR4 thickness: 0.3/0.4/0.8/1.0/1.2/1.5/2.0/2.4/3.2mm *Small quantities are available *Golden finger *HAL & chemical tin
New Equipment | Assembly Services
Material: FR-4 Layer: 2 Board thickness: 1.0 mm Copper: 1 oz Surface finish: LEAD FREE HASL Min through hole: 0.3 mm Min line width: 0.3 mm Min line space:0.3 mm Soldermask color: Green Silkscreen color: white RoHS certificate
Electronics Forum | Mon Mar 08 16:16:53 EST 2004 | Daniele
I have got information that MicroFlex (re-engineered version Ultraprint) screen printer from MPM can handle with 0.3mm fine pitch. Does any one make 0.3 mm print test?. What is the effectivnes MicroFlex for 0.3 fine pitch and is it reliability proces
Electronics Forum | Mon Nov 16 20:22:52 EST 2015 | billthebuilder
I need one for testing a PnP machine. It's very hard to hunt something down just by package, so does anyone know of anything with a 0.3mm pitch? BGA preferred. Or clues where to look? Thanks!
Used SMT Equipment | Chipshooters / Chip Mounters
FUJI, Chip Shooter, type CP643E, s.n. 2066, Left to right, cap. 40.000 CPH, Device input 140-8mm, with 20 heades, 6 nozels each, 2 tables 70 feeders each, PCB dimensions Max: 457mm x 356mm Min: 80mm x 60mm,Board Thickness: 0.3 to 4.0 mm, Component ca
Used SMT Equipment | Chipshooters / Chip Mounters
FUJI, Chip Shooter, type CP643E, s.n. 1278, Left to right, cap. 40.000 CPH, Device input 140-8mm, with 20 heades, 6 nozels each, 2 tables 70 feeders each, PCB dimensions Max: 457mm x 356mm Min: 80mm x 60mm,Board Thickness: 0.3 to 4.0 mm, Component ca
Industry News | 2005-09-19 16:07:56.0
No higher temperature and No process changes needed
Industry News | 2003-03-06 08:29:50.0
Coretec experienced sequential growth in sales over the last four quarters and, while its yearly sales did decline, said its sales record still compares favorably
Parts & Supplies | Repair/Rework
The RocHard 1 MilProbe is a 0.3" long Micro-tip in a 4 3/8" long hex shape stainless steel handle. The Micro-tip is tapered to a one mil diameter tip for TAB, BGA, and other ultra fine pitch rework. The tip is either straight (SH-341) or 50? angled a
Parts & Supplies | Screen Printers
Product Name: 10inch; MPM printing doctor blades Part Number: 10 inch; 254mm length Description: 10 inch; MPM printers 254mm * 32mm * 0.3mm scraper blades Applicable models: UP2000 machine 10 inch; MPM printers 254mm * 32mm * 0.3mm scraper
Technical Library | 2019-01-09 19:19:52.0
The electronics industry has widely adopted Sn-3.0Ag-0.5Cu solder alloys for lead-free reflow soldering applications and tin-copper based alloys for wave soldering applications. In automated soldering or rework operations, users may work with Sn-Ag-Cu or Sn-Cu based alloys. One of the challenges with these types of lead-free alloys for automated / hand soldering operations, is that the life of the soldering iron tips will shorten drastically using lead-free solders with an increased cost of soldering iron tool maintenance/ tip replacement. Development was done on a new lead-free low silver solder rework alloy (Sn-0.3Ag-0.7Cu-0.04Co) in comparison with a number of alternative lead-free alloys including Sn-0.3Ag-0.7Cu, Sn-0.7Cu and Sn-3.0Ag-0.5Cu and tin-lead Sn40Pb solder in soldering evaluations.
Technical Library | 2017-09-28 16:36:33.0
These nano-coatings also refine the solder paste brick shape giving improved print definition. These two benefits combine to help the solder paste printing process produce an adequate amount of solder paste in the correct position on the circuit board pads. Today, stencil aperture area ratios from 0.66 down to 0.40 are commonly used and make paste printing a challenge. This paper presents data on small area ratio printing for component designs including 01005 Imperial (0402 metric) and smaller 03015 metric and 0201 metric chip components and 0.3 mm and 0.4 mm pitch micro BGAs.
E1330717000 ZST SHUTTER GUIDE E1330721000 COVER FUR E133072100A COVER FUR (ST) E133072100B COVER FUR (ZN) E1330725000 COVER FUR E13307250B0 COVER (UPPER) SUB ASM. E1330725FA0 COVER (UPPER) ASM.(STB) E1331706000 FEEDING CAM PLATE E1331
03010187S01 PE-UHMW FOIL 42,5 x 0,5 mm x 40m/Rol 03010315S01 Maglev MWA120-0064 03010326S01 PE-UHMW GLUE TAPE 50 x 0,3mm x 16,5m 03010329S01 HOLDER FEEDER SLIDE SPRING/X8 03010352-01 Tension spring d=0,63* D=5,6* Lo=23,3 03010415
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Wed Jul 21 00:00:00 EDT 2021 - Fri Jul 23 00:00:00 EDT 2021 | ,
The smarter E Industry Days
Career Center | Mysore, India | Engineering,Production,Quality Control,Technical Support
· New Product production line setup, Risk assessment, quality system deployment. · Process Engineering activities, PCB Design review w.r.t Design for manufacturability in Pilot lot. · Printed wiring Assembly Process Improvement (Stencil, PCB type, sc
Career Center | , Israel | Engineering,Maintenance,Technical Support
I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-taiwan/
we’ll give you your quote in return! Save 20% or more with our new pricing! PCB Specifications View Matrix Part Number * Revision Quantity * Thickness 0.062" 0.078" 0.093" 0.125" Layers * Select One 1 2 3 4 5 6 8 Dimensions
AATEC Ltd | https://aatec.ch/mc-contactless.php
Contactless touchless Pick and Place System - AATEC SA Switzerland - SMT Equipment +41 (0)32 566 10 91 info@aatec.ch Toggle navigation Home Machines / Modules Machines ● PICO Pick & Place ● LISA Pick & Place ● NANO Pick & Place ● SPECIAL Machines