SPECIFICATION Stencil 370×470mm 420×520mm 550×650mm Max print size 300 × 400mm (standard), 500*600mm (optional) PCB width 0.2 ~2.0mm Printing adjustment X ±10mm Y ±10mm Accuracy ±0.05mm Repeating ±0.02mm Min pitch 0.35mm Power supply AC22
New Equipment | Test Equipment
For wearable devices and slimmer designed electronic products, we provide you two kinds of probe style test connector: 0.2mm and 0.35mm. Now you are allowed to achieve side access connection by 0.2mm probe directly, simulate FFC / FPC connectors; or
Electronics Forum | Fri Mar 30 23:35:43 EDT 2007 | mika
Question: Does this formula apply even for the small LGA:s like LGA36 6.5 x 3.5 x 0.6 mm pad size 0.35mm pitch 0.60mm? We use a 0.13 mm stencil thichess beacuse on the same board there is some P.I.P comps. The board dimensions is 35 x 50 mm on a pane
Electronics Forum | Fri Jul 18 10:04:32 EDT 2003 | jseagle
Hi all, I am looking for some recommendations on Underfill Equipment. Such as vendors, pumps, material, etc... We will be initially underfilling a 10mm x 10mm, 0.8mm pitch, 0.35mm ball uBGA on FR4 and going down in size and pitch from there. And
Industry News | 2018-11-27 07:02:53.0
Naprotek today announced plans to exhibit at the SMTA Silicon Valley Expo & Tech Forum, scheduled to take place Wednesday, Nov. 28, 2018 at Bestronics, Inc. in San Jose, CA.
SMTnet Express, December 31, 2015, Subscribers: 23,946, Members: Companies: 14,865, Users: 39,660 Study on Solder Joint Reliability of Fine Pitch CSP Yong Hill Liang, Hank Mao, YongGang Yan, Jindong (King) Lee; AEG, Flex (Flextronics International
