Industry Directory | Manufacturer
Contract manufacturer of hybrid ICs and PCB assemblies
Industry Directory | Manufacturer
Bones Electronics design and manufacture toroidal transformers,EI lamination transformers,toroidal iron cores wound by sillicon steel tapes. OEM and ODM accept.CE,ROHS,UL,VDE approved.
Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
Waterjet allows for improved cutting tolerances, improved lead times and the ability to provide highly complex geometry. Using a stream of water with forces of 55,000 PSI yields fast production rates and tool free cutting. Our single head and 4-head
Electronics Forum | Wed Mar 02 05:04:36 EST 2005 | ABHI
What is your micro BGA requiremnets? I mean ball dia / height with a 0.5 mm pitch? I can give you the stencil design, if you make known the parameters.
Electronics Forum | Mon Feb 28 06:06:04 EST 2005 | Guest
I'm looking for recommendations on pad and stencil design for products with 0.5 mm pitch BGA's. The latest info that I found in the archives of this forum dated more than a year ago. It didn't give me much confidence that assembly of such components
Used SMT Equipment | SMT Equipment
Model :KE-750 Placement speed：14, 400CPH(0.25sec/chip) Component mount range:1.0x0.5mm~□20mm or 23.5x11mm Station:80 Power supply:1P/200V/2.5KVA Size:1,400x1, 410x1, 551mm Weight:1,150kg
Used SMT Equipment | SMT Equipment
Model :KE-750 Placement speed：14, 400CPH(0.25sec/chip) Component mount range:1.0x0.5mm~□20mm or 23.5x11mm Station:80 Power supply:1P/200V/2.5KVA Size:1,400x1, 410x1, 551mm Weight:1,150kg
Industry News | 2016-07-16 13:32:29.0
Advanced dispense technology is available for integration into your dispensing system. Continuously Volumetric, drip-and-drool free dispense technology can now be retrofitted into your dispense robot. GPD Global's Volumetric PCD pumps ensure the success of applications like underfill, LED encapsulation, solder mask, silicones, conductive ink, conformal coatings, and more. Improve your throughput and yields by retrofitting a Volumetric PCD Pump into your dispense system to simplify the dispense process.
Industry News | 2016-12-09 23:33:42.0
GPD Global offers advanced dispense pump technologies to upgrade your existing platform and take advantage of existing capital equipment. Retrofit your system with innovative dispensing technology for excellent dispense control and repeatability.
Parts & Supplies | SMT Equipment
YAMAHA Nozzle Shaft Part Name:YAMAHA YV100XG STD SHAFT Part No:KGB-M71S0-50X More Yamaha parts in stocks KG3-M7190-00X Yamaha Needle Connector 12YM KGT-M7106-00X Yamaha YG200 Shaft Nozzle Holder KHN-M7720-A1X Yamaha YS12 302A Nozzle KHN-M7
Parts & Supplies | Chipshooters / Chip Mounters
Model :KE-750 Placement speed：14, 400CPH(0.25sec/chip) Component mount range:1.0x0.5mm~□20mm or 23.5x11mm Station:80 Power supply:1P/200V/2.5KVA Size:1,400x1, 410x1, 551mm Weight:1,150kg Currently, all the machines with very good competitive
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2015-08-27 15:32:16.0
Ever since there has been a widespread usage of surface mount parts, the trend of continued shrinkage of devices with ever finer pitches has continued to challenge PCB assemblers for the rework of same. Todays' pitches are commonly 0.5 to 0.4mm with packages of tiny outline sizes, 5 -10mm square, making the rework of such devices a challenge. In addition to the handling and inspection challenges comes the board density. Spacing to neighboring components continues to be compressed so the rework techniques should not damage neighboring components.
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
0.5M automatic inspection pcb conveyor and PCB Belt Conveyor|PCB transfer conveyor used for equipment linking, visual inspection, manual assembly, and PCB buffering functions https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_conveyor/179.htm
Events Calendar | Tue May 17 00:00:00 EDT 2022 - Thu May 19 00:00:00 EDT 2022 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference and Exhibition
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: BSCS(GPA 3.0 or higher), 0-5 years experience in at least 1 of the following: Embedded Systems, PSost, Unix, C/C++, Pascal; knowledgeable of data structures, real-time operating systems, finite state systems, programming in a st
Career Center | Noida, India | Engineering
I have done my B.tech from EC branch so I have lots of knowledge about EC branch. I have knowledge in IE3D software because my college project and Training project based on this software.Additionally, I have knowledge in Networking and linux.I have e
Career Center | Noida, India | Engineering
I have done my B.tech from EC branch so I have lots of knowledge about EC branch. I have knowledge in IE3D software because my college project and Training project based on this software.Additionally, I have knowledge in Networking and linux.I have e
widely adopted Sn-3.0Ag-0.5Cu solder alloys for
