Sunshine manufactures the most advanced stencils powered by LPKF's laser Technology. By combining our experience with the newest technology, we produce unrivaled results Laser stencil specifications: Resolution 0.5 mm Axial Precision �4μm
TP300 is the simplest solution, the most compact-size and lowest-cost solder paste printer, it can be easy and accurate to print the solder paste on any board. Please see details below: 1). It is suitable for both single-sided and double-sided p
Electronics Forum | Tue May 07 08:18:12 EDT 2002 | Sir Alexandr
Almst quality of PCB with this pitch defined on used boards. Good board produses Fullmarks , look up to it , stencil parametrs isnt so critical but board material and layouts.
Electronics Forum | Thu May 09 17:22:56 EDT 2002 | davef
I have no opinion on the accuracy and repeatability tolerances you should be looking for on the vision system and the actual alignment of the stencil. I expect Cp=2 from my printer.
Industry News | 2019-04-03 20:07:41.0
Practical Components is a leading international distributor of mechanical IC samples or “dummy” components that has added a new SMTA Solder Paste Test Vehicle for Miniaturized Surface Mount Technology (SMT) to its array of Dummy Components, Solder Training Kits and PCB Evaluation Kits.
Parts & Supplies | Repair/Rework
main features The full-automatic BGA Ball Mounting machine PG-FA6800 is composed of IPC control system, high-speed 12 axis motion control system, high definition Vision inspection system, convenient operation system, and automatic orientation contr
Parts & Supplies | Repair/Rework
main features The full-automatic BGA Ball Mounting machine PG-FA6800 is composed of IPC control system, high-speed 12 axis motion control system, high definition Vision inspection system, convenient operation system, and automatic orientation contr
Technical Library | 2007-05-31 19:05:55.0
This paper discusses solder paste printing and flux dipping assembly processes for 0.4 and 0.5mm pitch lead-free WLCSPs and the corresponding assembly results and thermal cyclic reliability obtained. Variables evaluated include reflow ambient, paste type, and stencil design. Reliability is also compared to results for the same components assembled under identical conditions using SnPb solder.
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LV Series Vacuum Reflow Oven SMT Stencil Printing Machine Semi-auto SMT Stencil Printer Full-auto SMT Stencil Printer Pick & Place Machine SAMSUNG Pick
