New Equipment | Solder Materials
For BGA's and PCB Production and Rework Sphere Accurate to +/- .001, All standard sizes available Standard Sizes of Sphere's: .035" +/- .002 10SN/90PB High-Temp .030" +/- .001 63SN/37PB .022" +/- .001 63SN/37PB .016" +/- .001 63S
170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T
Electronics Forum | Sun Mar 31 00:42:09 EDT 2013 | dhanish
Why we cannot run Pb Free BGA with Sn/Pb process but we can run high temp BGA(90/10) with Sn/Pb? Both require high temperature to form the IMC.Why there is a difference in the reliability?
Electronics Forum | Mon Oct 03 16:19:22 EDT 2005 | Amol
for backward compatibility applications (such as this), the higher melting temperature alloy (LF alloy) gets the priority in selecting the reflow profile. you are using too low temps for reflow. your LF alloy wont reflow at these temp and you will e
Used SMT Equipment | Soldering - Reflow
BTU Pyramax 98A IBE SMT Inventory ID : 101014-002 BTU Serial Number : NRM-9 Vintage : JUN 2006 Details Edge Rail Conveyor Center Board Support Includes Tek Temp TKD-100 Chiller 480 VAC 73 kVA Click Here for m
Used SMT Equipment | In-Circuit Testers
Key Features & Specifications: Signal characteristics 250 kHz to 3 GHz +17 dBm output power Modulation and sweep AM, FM, øM, and pulse ASK, FSK, MSK, PSK, QAM, custom I/Q Step, or list, frequency and power Baseband generation and signal
Industry News | 2003-04-17 11:35:44.0
Honored for their contributions to IPC and the electronics industry
Industry News | 2021-05-18 14:19:48.0
Photon steam aging system provides accelerated life testing simulating elongated storage conditions for high reliability applications.
Parts & Supplies | Chipshooters / Chip Mounters
E3051729000 Z SLIDER SHAFT JUKI E3044802000 CNB INNER BLOCK E30448020A0 CONNECTOR BLOCK ASM. E30457000A0 STOPPER PLATE ASM E3045706A00 REEL PRESSER SHAFT 12 E3045715000 NOZZLE SPRING 01 E3045729000 Z SENSOR DOG E3045802000 CNB PUSHER PLATE E
Parts & Supplies | SMT Equipment
E3051729000 Z SLIDER SHAFT E3044802000 CNB INNER BLOCK E30448020A0 CONNECTOR BLOCK ASM. E30457000A0 STOPPER PLATE ASM E3045706A00 REEL PRESSER SHAFT 12 E3045715000 NOZZLE SPRING 01 E3045729000 Z SENSOR DOG E3045802000 CNB PUSHER PLATE E30467
1.Product parameter Total Power 2500W Top heater 1200W Bottom heater 1200W Power AC110~240V±10% 50/60Hz Operation mode
A sneak peek at SparkFun's new LEADSMT Stencil Printer Tags: Business Talent: Robert Hunke
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
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The Relationship between Backward Compatible Assembly and Microstructure on the Thermal Fatigue Reliability of an Extremely Large Ball Grid Array SMTnet Express June 22, 2012, Subscribers: 25283, Members: Companies: 8903, Users: 33267
HALT Testing of Backward Soldered BGAs on a Military Product Online Version SMTnet Express, December 10, 2015, Subscribers: 23,782, Members: Companies: 14,767, Users: 39,402 Packaging Technology and Design Challenge for Fine Pitch Micro-Bump Cu
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/webinars.cfm
Power and High Temp Electronics Manufacturing Dr. Chris Hunt and Bob Willis Free! 2014 Higher Density Packaging: Manufacturability & Reliability Cheryl Tulkoff $200.00 2014 Tin Whiskers: All You Should Know