New Equipment | Solder Materials
AIM’s W20 water soluble solder paste is a zero halide/halogen flux formula. W20 has been engineered for enhanced wetting performance on all solderable electronic surfaces. W20 exhibits excellent print characteristics and 8+ hours of stencil life. W20
New Equipment | Solder Materials
8 hours), and abandon time (>4 hours) Printing: Suitable for high speed printing up to 150 mm/s Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection Careful contr
Electronics Forum | Fri Dec 03 04:20:18 EST 2010 | grahamcooper22
Hi In Dec 2008 the IPC J STD 004 was updated to 004B, and I am wondering what the new test conditions are for testing flux Surface Insulation Resistance and Electro Migration Potential within the new spec. I am looking for the recommended test temp
Electronics Forum | Thu May 11 11:25:56 EDT 2017 | davef
Key to Rosin Fluxes [from SUPERIOR FLUX & MFG. CO.] Type R (Rosin): Non-activated rosin flux for soldering copper. Residues are non-corrosive and non-conductive. Type RMA (Rosin Mildly Activated): Mildly activated rosin flux that contains no chlori
Used SMT Equipment | Soldering Equipment/Fluxes
Ersa Versaflow 40/50 IBE SMT Inventory ID : 120423-001 Ersa Serial Number : S004B-06C0248 Vintage : MAR 2006 Details Single Pot Automatic Solder Wire Feeder SMEMA Communication Top Side Convection Pre Heater Click Here fo
Industry News | 2009-04-15 23:12:38.0
BANNOCKBURN, Ill., USA, April 1, 2009 � IPC � IPC � Association Connecting Electronics Industries� presented Special Recognition, Distinguished Committee Leadership and Distinguished Committee Service awards at IPC APEX EXPO 2009, held March 31�April 2 in Las Vegas.
Industry News | 2012-02-28 14:00:06.0
IPC presented Presidents, Special Recognition, Distinguished Committee Leadership and Committee Service Awards at IPC APEX EXPO® at the San Diego Convention Center.
Parts & Supplies | THT Equipment
X004-059 FIX BLADE A X004-060 FIX BLADE B X004-061 MOVING BLADE A X004-062 MOVING BLADE B X004-080 CHUCK LEVER A X044-051 LEAD GUIDE PIN GUIDE (0.7)(3孔) X044-403 CARTRIDGE X050-910 GUIDE PIN GUIDE (0.7)(2孔) X050-926 TAPE CUTTER X050-927 TAPE
Parts & Supplies | THT Equipment
X004-221 JOINT X004-223 COLLAR X004-224 SPRING HOLDER BOLT X004-231 PIN X004-244 LEVER X004-246 PLATE X004-248 PUSHER X004-250 LEAD CUTTER X004-255 TAPE CUTTER X004-256 LEAD CUTTER X004-260 ROD X004-266 PIN X004-268 BEARUNG HOLDER X004-269 STOPPER HR
Technical Library | 2017-02-09 17:08:44.0
The SMT assembly world, especially within the commercial electronics realm, is dominated by no-clean solder paste technology. A solder paste flux residue that does not require removal is very attractive in a competitive world where every penny of assembly cost counts. One important aspect of the reliability of assembled devices is the nature of the no-clean solder paste flux residue. Most people in this field understand the importance of having a process that renders the solder paste flux residue as benign and inert as possible, thereby ensuring electrical reliability.But, of all the factors that play into the electrical reliability of the solder paste flux residue, is there any impact made by the age of the solder paste and how it was stored? This paper uses J-STD-004B SIR (Surface Insulation Resistance) testing to examine this question.
Technical Library | 2017-07-13 16:16:27.0
Controlled humidity and temperature controlled surface insulation resistance (SIR) measurements of flux covered test vehicles, subject to a direct current (D.C.) bias voltage are recognized by a number of global standards organizations as the preferred method to determine if no clean solder paste and wave soldering flux residues are suitable for reliable electronic assemblies. The IPC, Japanese Industry Standard (JIS), Deutsches Institut fur Normung (DIN) and International Electrical Commission (IEC) all have industry reviewed standards using similar variations of this measurement. (...) This study will compare the results from testing two solder pastes using the IPC-J-STD-004B, IPC TM-650 2.6.3.7 surface insulation resistance test, and IPC TM-650 2.3.25 in an attempt to investigate the correlation of ROSE methods as predictors of electronic assembly electrical reliability.
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/solder-paste/fluxplus-paste-flux
. Dispensing Flux Printing Flux Flux Type RMA RA NC WS WS WS WS RMA NC WS Flux Class J-STD-004B ROL0 ROL1 ROL1 ORH1 ORH1 ORL0 ORH1 ROL0 ROL1 ORL0 Formula 07D00 41D00 21D00 71D00 72D00 63D00 67D00 08P00
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
per J-STD-004B) flux coating and produced to match the substrate size with a 1:1 ratio. All solder and flux TIM products used are commercially available. Figure 10: Basic flow chart of the experimental procedure. For the prebake step, the entire test
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