Industry Directory | Consultant / Service Provider / Manufacturer
Company Kibernetika offers outsourcing in assembly and embedded boards production. Our knowledge and experience lead us to focus on SMT production. One Samsung SMT line, and one line for prototypes.
Industry Directory | Consultant / Service Provider / Manufacturer
Bangkok company providing medium volume lead-free SMT printed circuit board assembly (PCBA) and box build service. We provide full turnkey service and/or material consignment. Sample boards are : electronics ballast, LED driver and motor driver.
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YAMAHA NOZZLE SERIES Brand Model Specification Material of nozzle tip YAMAHA YV100II 31#NOZZLE 0402 / 0603 / 0805 (X) Tungsten steel YAMAHA YV100II 31#NOZZLE 0402 / 0603 / 0805 (X) Diamond steel YAMAHA YV100II 32#NOZZLE For IC of tiny size Tungst
Yamaha YAMAHA YS12 312A NOZZLE YAMAHA YS12 312A NOZZLE YAMAHA Nozzle List Brand Model Specification Material of nozzle tip YAMAHA YV100II 31#NOZZLE 0402 / 0603 / 0805 (X) Tungsten steel YAMAHA YV100II 31#NOZZLE 0402 / 0603 / 0805 (X) Diamond st
Electronics Forum | Tue Jun 06 20:02:55 EDT 2000 | Dave F
Ravi: I agree with travis. What's the issue?
Electronics Forum | Fri Jun 02 19:43:40 EDT 2000 | Ravi Bhat
One of my customers has asked about concerns, comments, ideas about putting 0402 packages on bottom side of the board. The process will be no clean with reflow/reflow. If anybody out there has some experience or concerns please comment. Regards
Used SMT Equipment | Chipshooters / Chip Mounters
FUJI, Chip Shooter, type CP643E, s.n. 2066, Left to right, cap. 40.000 CPH, Device input 140-8mm, with 20 heades, 6 nozels each, 2 tables 70 feeders each, PCB dimensions Max: 457mm x 356mm Min: 80mm x 60mm,Board Thickness: 0.3 to 4.0 mm, Component ca
Used SMT Equipment | Chipshooters / Chip Mounters
FUJI, Chip Shooter, type CP643E, s.n. 1278, Left to right, cap. 40.000 CPH, Device input 140-8mm, with 20 heades, 6 nozels each, 2 tables 70 feeders each, PCB dimensions Max: 457mm x 356mm Min: 80mm x 60mm,Board Thickness: 0.3 to 4.0 mm, Component ca
Industry News | 2018-10-18 08:00:40.0
SMT solder joint quality and appearance inspection process
Industry News | 2018-10-18 08:01:00.0
SMT solder joint quality and appearance inspection process
Parts & Supplies | SMT Equipment
Model:YAMAHA YV100II 31 Nozzle ( 0402 X-Small) YAMAHA Nozzle List Brand Model Specification Material of nozzle tip YAMAHA YV100II 31#NOZZLE 0402 / 0603 / 0805 (X) Tungsten steel YAMAHA YV100II 31#NOZZLE 0402 / 0603 / 0805 (X) Diamond steel Y
Parts & Supplies | SMT Equipment
YAMAHA YV100II 31 Nozzle ( 0402 X-Small) YAMAHA Nozzle List Brand Model Specification Material of nozzle tip YAMAHA YV100II 31#NOZZLE 0402 / 0603 / 0805 (X) Tungsten steel YAMAHA YV100II 31#NOZZLE 0402 / 0603 / 0805 (X) Diamond steel YAMAHA
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2021-09-01 15:31:39.0
The long-standing trend in the electronics industry has been the miniaturization of electronic components. It is projected that this trend will continue as Original Equipment Manufacturers (OEMs) and Electronic Manufacturing Service (EMS) providers strive to reduce "real estate" on printed circuit boards. Typically, the miniaturization of components can be achieved by integration or size reduction. At present, size reduction is considered to be more cost effective and flexible than integration. Passive components, which are used in limiting current, terminating transmission lines and de-coupling switching noise, are the primary focus in size reduction due to their variety of uses.
Model name CM602-L Model NM-EJM8A Substrate size L 50 mm × W 50 mm ～ L 510 mm × W 460 mm High-speed placement head 12 nozzles Mounting speed 100 000 cph (0.036 s/chip) Mounting accuracy ±40 μm/chip (Cpk ≧1) www.smt11.cn Co
1. Mounting speed: 30000CPH (IPC standard) 2. Number of feeders: 140 3. Number of mounting heads: 12 4. Mounting size: 330mm x 250mm 5. Size range: 0402MM ~ 50mm x 100mm square device 6. Component height: 15mm 7. Mounting accuracy: ±30&m
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
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