A turret modular mounting systems features both a high throughput and a high level of area productivity. High throughput of 48,000 cph with smallfootprint The mounter achieves an area productivity of 10,000 cph/m2 (under optimum operating co
Ridiculously high-speed placement with flexibility to handle larger components. A placement system with the ludicrous placement rate of 95000 cph, and flexibility to place components ranging from 0201(0603mm) chip to 100x26mm connector. Two in
Electronics Forum | Tue Oct 02 10:30:10 EDT 2012 | eniac
Difference in pick height from paper and embossed reel (typically) is 0.2 mm. Try to change your pick height and place height (different type of capacitors have a different height: for 100 nF 0603 and for 4.7 uF 0603 it's a big difference!). Can you
Electronics Forum | Thu Sep 27 15:09:24 EDT 2012 | ericrr
I notice that someone has set all the capacitors & resistors parts as emboss instead of paper tape. Does this make any difference to the pick and placement of the parts, By the way recently we changed from 1206 to 0603 parts, coming out of the mac
Used SMT Equipment | Pick and Place/Feeders
Samsung CP Feeder List 8*4 EMBOSS 70EA 8*2 PAPER 90EA 0603 6EA
Used SMT Equipment | Pick and Place/Feeders
Samsung CP Feeder List 8*4 EMBOSS 70EA 8*2 PAPER 90EA 0603 6EA
Parts & Supplies | Pick and Place/Feeders
Juki CF03HPR FEEDER 0201 Specs: 40081758 CF03HPR 8mm TAPE FEEDER UNIT FOR 0603 40081759 CF05HPR 8mm TAPE FEEDER UNIT FOR 1005 40081760 CF08HER 8mm TAPE FEEDER UNIT (2MM PITCH) 40081761 CF081PR 8mm TAPE FEEDER UNIT 40081762 CF081ER 8
Parts & Supplies | Pick and Place/Feeders
Juki CF03HPR FEEDER 0201 Specs: 40081758 CF03HPR 8mm TAPE FEEDER UNIT FOR 0603 40081759 CF05HPR 8mm TAPE FEEDER UNIT FOR 1005 40081760 CF08HER 8mm TAPE FEEDER UNIT (2MM PITCH) 40081761 CF081PR 8mm TAPE FEEDER UNIT 40081762 CF081ER 8
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
JUKI feeder calibration---ZK Electronic Technology Co., Limited
Feed Cut Tape without a leader works with the Samsung SME 8mm Feeder.
