New Equipment | Assembly Services
China Double Sided Circuit Boards Fabricaiton and Assembly PCBA Turnkey Manufacturer 2 Layers circuit boards PCB FR4 1.6mm PCB fabrication and assembly 1oz PCB copper thickness Shenzhen PCB and PCBA manufacturer China turnkey contract electroni
China Automatic Solder paste printer for SMT assembly line Factory Supplier Power Supply: AC:220±10%,50/60HZ Control Method: PC Control PCB Size/Max: 850*500mm Weight Approx:1300Kg Product description: China Automatic Solder paste print
Electronics Forum | Mon Aug 28 17:54:59 EDT 2000 | Steve Thomas
We're trying out 0603 packages on some 0805 footprints (at this stage only on some test boards) since our vendor tells us the 0805's are going to be getting harder to get, and more expensive to pay for. I understand the IPC footprint for the two is
Electronics Forum | Mon Aug 28 18:21:13 EDT 2000 | Earl Moon
Steve, If interested in more vital input - contact me offline. It's not just the factors you indicate but those of reliability. Earl Moon
Parts & Supplies | Assembly Accessories
Yamaha Feeder available: YAMAHA CL Feeder Part No: Yamaha CL 8*2mm Feeders for 0201 KW1-M1300-000 Yamaha CL 8*2mm Feeders for 0402 KW1-M1400-00X Yamaha CL 8*4mm Feeders KW1-M1100-030 Yamaha CL 12mm Feeders KW1-M2200-300 Yamaha CL 16mm Feeders K
Parts & Supplies | Assembly Accessories
Yamaha Feeder available: YAMAHA CL Feeder Part No: Yamaha CL 8*2mm Feeders for 0201 KW1-M1300-000 Yamaha CL 8*2mm Feeders for 0402 KW1-M1400-00X Yamaha CL 8*4mm Feeders KW1-M1100-030 Yamaha CL 12mm Feeders KW1-M2200-300 Yamaha CL 16mm Feeders K
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2021-08-25 16:28:36.0
In this study, a Sn–Bi composite solder paste with thermosetting epoxy (TSEP Sn–Bi) was prepared by mixing Sn–Bi solder powder, flux, and epoxy system. The melting characteristics of the Sn–Bi solder alloy and the curing reaction of the epoxy system were measured by differential scanning calorimeter (DSC). A reflow profile was optimized based on the Sn–Bi reflow profile, and the Organic Solderability Preservative (OSP) Cu pad mounted 0603 chip resistor was chosen to reflow soldering and to prepare samples of the corresponding joint. The high temperature and humidity reliability of the solder joints at 85 #14;C/85% RH (Relative Humidity) for 1000 h and the thermal cycle reliability of the solder joints from
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