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Morel Router CMQ360 PCB seperator
New Equipment | Solder Paste Stencils
Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o
Electronics Forum | Thu Jan 04 12:51:37 EST 2007 | Board House
Hi Chunks, Starting copper on outer layer with .0007 is 1/2 oz. copper foil. so if starting copper is .0007 and your Board house will plate an additional .0021 mils of copper. which will give you a finished copper weight of .0028 Mils or (2 oz.) Y
Electronics Forum | Thu Oct 27 12:58:33 EDT 2005 | gregp
EIA-481-B Max tape thickness 1.1mm (not including bottom and top cover tapes which can be .1mm max each) Of course a 1.1mm thick piece of steel will be stiffer than a 1.1mm thick lasagna noodle (already cooked). Is the thickness the issue or is it t
Used SMT Equipment | In-Circuit Testers
1988 Thermotron FA-4-CH-1-1 Environmental Chamber Temperature Range: -73C to 177C (-99F to 351F) Control Accuracy: 1.0+/- C Internal Dimensions: 20" x 20" x 20" External Dimensions: 32" x 34" x 82" Power: 208VAC; 28A; 60Hz; 3 Phase Serial: 165
Used SMT Equipment | Pick and Place/Feeders
2012 Mydata My100LXe-10 Pick and Place Make: Mydata Model: MY100LXe-10 Vintage: 2012 Description: SMT Pick & Place Software: 5.1.1a Condition: Complete & Operational Location: USA Availability: Immediate Shipping: EXW Origin Terms: 100% Prepay Pleas
Industry News | 2003-02-03 11:33:39.0
Will Consolidate Its PWB Business by the End of Next Year
Industry News | 2020-03-26 17:18:25.0
IPC Releases PCB Industry Results for February 2020
Parts & Supplies | SMT Equipment
Belt&Pulley Part Name:SONY皮带 (2.3x1.1x1015mm) PART No:4-722-644-01 Part Name:SONY皮带 (2.3x1.1x640mm) PART No:4-722-644-21 Part Name:SONY皮带 (2.3x1.1x1870mm) PART No:4-720-921-11 Part Name:SONY皮带 (2.3x1.1x545mm) PART No:4-722-644-31 Pa
Parts & Supplies | SMT Equipment
Belt&Pulley Part Name:SONY (2.3x1.1x1015mm) PART No:4-722-644-01 Part Name:SONY (2.3x1.1x640mm) PART No:4-722-644-21 Part Name:SONY (2.3x1.1x1870mm) PART No:4-720-921-11 Part Name:SONY (2.3x1.1x545mm) PART No:4-722-644-31 Part Name:
Technical Library | 2015-02-05 20:25:41.0
In the past 20 yrs the solvent industry has gone through a great deal of change. In the early 1990s, CFC-113 and 1,1,1-trichloroethane were the workhorses of the industry. The Montreal Protocol to phase-out substances that deplete the Earth's protective Ozone Layer was implemented in the mid 1990s. After phase-out of the CFC solvents, the solvent industry fragmented to a variety of cleaning solutions. The electronics industry was a large user of CFC solvents and many of these applications changed to aqueous based cleaners (...) But those alternatives are now facing various problems: e.g. aqueous based cleaners use a lot of energy, require long drying times, use equipment that requires frequent maintenance, and require a large footprint; no-clean fluxes leave flux residues; and trichloroethylene and n-propyl bromide have toxicity issues. In response to these serious issues newer solvents and blends are being introduced in the marketplace
we have many hitachi equipment and hitachi feeders to sell . if you want to know more , please contact us tina@smtfeeders.cn
FF12FS JUKI 12mm FEEDER FF16FS JUKI 16mm FEEDER FF24FS JUKI 24mm FEEDER FF32FS JUKI 32mm FEEDER FF44FS JUKI 44mm FEEDER FF56FS JUKI 56mm FEEDER E35007210A0 NOZZLE ASM.(730) 1 E35507210A0 NOZZLE ASM.(730) 1 E35017210A0 NOZZLE ASM. 101 3 E35
Events Calendar | Mon Jul 08 00:00:00 EDT 2024 - Mon Jul 08 00:00:00 EDT 2024 | ,
Heartland Chapter Technical Webinar: Virtual STAR Forum
Career Center | banaglore, karnataka India | Maintenance,Production,Quality Control,Technical Support
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Career Center | Mysore, India | Engineering,Production,Quality Control,Technical Support
· New Product production line setup, Risk assessment, quality system deployment. · Process Engineering activities, PCB Design review w.r.t Design for manufacturability in Pilot lot. · Printed wiring Assembly Process Improvement (Stencil, PCB type, sc