Electronics Forum | Sat Jun 12 00:34:00 EDT 2004 | kanwal324
Hi ! The main problem being faced currently is formation of solder balls - to be precise, these are micro solder beads generally found attached with bodies of SOTs, Chip Caps, Chip Resistors, between pins of SOICs (50 mil) - lying on PCB surface,
Used SMT Equipment | SMT Equipment
Omron VTWin II, year 2008 with whole loading / unloading system as following x 2 sets Omron RBT, year 1999 with whole loading / unloading system as following x 2 sets customerst@163.com AOI OMRON
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