Serving the Electronics manufacturing industry. We provide the following services: Equipment maintenance and repair. Equipment setup, installation and training. Equipment locating, inspection and prep services. Technical procedure creation. Process I
Electronics Forum | Fri Apr 25 10:40:45 EDT 2003 | jonfox
Do you use mass trolleys (slim elements) or standard feeders?
Used SMT Equipment | Pick and Place/Feeders
Philips Emerald SMT Pick & Place Type: PA130820 Vintage: 2000 Condition: Complete & Operational Location: California Note: Feeders and Carts Included
Used SMT Equipment | X-Ray Inspection
Make: Omron Model: VT-X700-L Vintage: 2017 Description: X-Ray Inspection System Condition: Complete & Operational Location: California USA Asking Price: Make an Offer
Industry News | 2015-02-20 10:40:18.0
Baja Bid’s latest online auction with equipment from multiple customers in the USA will close on February 24, 2015.
Industry News | 2022-04-06 10:40:59.0
New data from IPC show that the electronics manufacturing supply chain is already feeling the impact of the Russia-Ukraine War.
Parts & Supplies | Pick and Place/Feeders
CP 8MM FEEDER WEIGHT:8MM 2.7KG jenny@ksunsmt.com
Technical Library | 2016-09-15 17:10:40.0
This paper describes the purpose, methodology, and results to date of thermal endurance testing performed at the company. The intent of this thermal aging testing is to establish long term reliability data for printed wiring board (PWB) materials for use in applications that require 20+ years (100,000+ hours) of operational life under different thermal conditions. Underwriters Laboratory (UL) testing only addresses unclad laminate (resin and glass) and not a fabricated PWB that undergoes many processing steps, includes copper and plated through holes, and has a complex mechanical structure. UL testing is based on a 5000 hour expected operation life of the electronic product. Therefore, there is a need to determine the dielectric breakdown / degradation of the composite printed circuit board material and mechanical structure over time and temperature for mission critical applications.
Technical Library | 2018-04-05 10:40:43.0
The miniaturization of microchips is always driving force for revolution and innovation in the electronic industry. When the pitch of bumps is getting smaller and smaller the ball size has to be gradually reduced. However, the reliability of smaller ball size is getting weaker and weaker, so some traditional methods such as capillary underfilling, corner bonding and edge bonding process have been being implemented in board level assembly process to enhance drop and thermal cycling performance. These traditional processes have been increasingly considered to be bottleneck for further miniaturization because the completion of these processes demands more space. So the interest of eliminating these processes has been increased. To meet this demand, YINCAE has developed solder joint encapsulant adhesives for ball bumping applications to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. In this paper we will discuss the ball bumping process, the reliability such as strength of solder joints, drop test performance and thermal cycling performance.
Training Courses | | | IPC/WHMA-A-620 Specialist (CIS)
The Certified IPC/WHMA-A-620 Specialist (CIS) training focuses on cable and wire harness fabrication and installation.
Training Courses | | | IPC-7711/7721 Trainer (CIT) Recert.
The Certified IPC-7711/7721 Trainer (CIT) recertification courses are intended for those individuals who were previously accredited to provide Certified IPC-7711/7721 Trainer (CIS) training.
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: 3+ years experience in electronic manufacturing; with SMT new product introductions. Strong DFM experience. Duties/Functions: Provide DFM input to all new products. Interface with design and sustaining engineering to ensure ro
Career Center | , California Malaysia | Management,Sales/Marketing
Director of Business Development in Penenag, Malasia urgently needed for rapidly growing global EMS provider. This position will have the opportunity to head up all of sales, marketing, pricing and negotiating on the front lines. This is a rare opp
Career Center | Pusing, Malaysia | Engineering
I am interested to be a part of the organization where I can fully utilize my skills and make a significant contribution to the success of the employer and at the same time my individual growth. It is also another precious opportunity for me to explo
Career Center | Pusing, Malaysia | Engineering
I am interested to be a part of the organization where I can fully utilize my skills and make a significant contribution to the success of the employer and at the same time my individual growth. It is also another precious opportunity for me to explo
