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Lead-free and Tin-lead Assembly and Reliability of Fine-pitch Wafer-Level CSPs
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TIM & Thermal Gap Filler Dispensing - Download our new guide for process considerations and popular configurations.
Easily dispense fine pitch components with ±25µm positioning accuracy.
Have you found a solution to
REDUCE DISPENSE REWORK
? Your answer is here.
Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Training online, at your facility, or at one of our worldwide training centers"
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[1/16] Ultra-Thin Chips For High-Performance Flexible Electronics
[1/09] Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms
[1/02] Temperature Cycling and Fatigue in Electronics
[12/27] A Life Prediction Model of Multilayered PTH Based on Fatigue Mechanism
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