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Lead Free Reflow Oven Infrared Heating-Reflow Soldering Oven-Reflow oven,SMT Reflow Soldering Oven-c

| http://etasmt.com/te_product_g_c646/2023-04-22/20629.chtml

. ❙  Specification of Reflow Soldering Oven Model E8 E10 Dimension (L*W*H)mm 5000x1250x1490 5800x1250x1490 Weight Approx. 1600KG Approx. 1800KG Number Of Heating Zones Up8/Bottom8 Up10/Bottom10 Length Of Heating Zones 3121mm 3891mm Rail Width Adjustment M(option:A

Hot Bar Reflow Soldering Systems | Nordson DIMA

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/processes/hot-bar-reflow-soldering-systems?con=t&page=4

. Process For components that require a very precise positioning, Hot Bar Reflow Soldering is the most ideal process. Pulsed heated soldering differs from traditional soldering because the reflow of solder is accomplished using a heating element called a thermode which is heated and cooled down for each connection

ASYMTEK Products | Nordson Electronics Solutions


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