Microelectronics and Semiconductor Inspection. MVP's 850G provides the highest accuracy flip-chip, die assembly inspection. Ensuring the correct placement of the die on the substrate, while providing edge, FM and surface inspection. The 850G modu
Electronics Forum | Mon Aug 19 07:42:59 EDT 2019 | robl
At least one of them looks like a handling issue to me - the last picture shows the crack going into the termination as a scratch on the right side - as if someone has slid another board into a magazine without leaving enough space. This one looks li
Electronics Forum | Fri May 15 16:02:40 EDT 1998 | John S
If you have a chance check out the MSD artical (Page 69) in April Electronic Packaging & Production. It is one of the worst articals with unsubstantiated conclusions I have ever seen. Notice Figure 3 on page 72, Caption indicates two simular compon
Industry News | 2006-04-17 11:14:44.0
Indium Corporation�s NF260 No-Flow Underfill was awarded the 2006 EM Asia
Industry News | 2016-08-19 05:00:52.0
If you have a process problem, let NPL Defect of the Month Video help you team
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Parts & Supplies | Assembly Accessories
12MM Calibration Tape .12MM Calibration Tape 20 Inch Folding Bike Ravel Case 20 Inch Folding Bike ravel Case 4*4.1200pcs/bag M0604 8MM Calibration Tape .8MM Calibration Tape 90 degree drive set 90 degree drive set A2E BGA Rework Station Temp Con
link:https://www.ascen.ltd/Blog/Solutio/493.html ASCEN PCB separator ASC-620 PCB cutting machine can use for cutting LED long board and also can use to the PCBA with the high component separate operation.It is the best way to replace the way to purch
link:https://www.ascen.ltd/Blog/Solutio/493.html ASCEN PCB separator ASC-620 PCB cutting machine can use for cutting LED long board and also can use to the PCBA with the high component separate operation.It is the best way to replace the way to purch
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As published in Circuits Assembly Magazine, Nov. 2017 MUF AND WAFERS GET NEW ACOUSTIC TOOL As published in Silicon Semiconductor Issue VI 2013 MATCHED TOOLS FOR ACOUSTIC MICRO-IMAGING As published in Evaluation Engineering, Feb 2016 WARPED WAFERS
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